ES492854A0 - Mejoras en una estructura de encapsulado electronico, pro- vista de un sustrato con areas de meseta - Google Patents

Mejoras en una estructura de encapsulado electronico, pro- vista de un sustrato con areas de meseta

Info

Publication number
ES492854A0
ES492854A0 ES492854A ES492854A ES492854A0 ES 492854 A0 ES492854 A0 ES 492854A0 ES 492854 A ES492854 A ES 492854A ES 492854 A ES492854 A ES 492854A ES 492854 A0 ES492854 A0 ES 492854A0
Authority
ES
Spain
Prior art keywords
substrate
encapsulated structure
plateau areas
electronic encapsulated
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES492854A
Other languages
English (en)
Other versions
ES8102416A1 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of ES492854A0 publication Critical patent/ES492854A0/es
Publication of ES8102416A1 publication Critical patent/ES8102416A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5385—Assembly of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Waveguide Connection Structure (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
ES492854A 1979-06-29 1980-06-27 Mejoras en una estructura de encapsulado electronico, pro- vista de un sustrato con areas de meseta Expired ES8102416A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/053,497 US4295183A (en) 1979-06-29 1979-06-29 Thin film metal package for LSI chips

Publications (2)

Publication Number Publication Date
ES492854A0 true ES492854A0 (es) 1980-12-16
ES8102416A1 ES8102416A1 (es) 1980-12-16

Family

ID=21984695

Family Applications (1)

Application Number Title Priority Date Filing Date
ES492854A Expired ES8102416A1 (es) 1979-06-29 1980-06-27 Mejoras en una estructura de encapsulado electronico, pro- vista de un sustrato con areas de meseta

Country Status (7)

Country Link
US (1) US4295183A (es)
EP (1) EP0021402B1 (es)
JP (2) JPS567491A (es)
BR (1) BR8004022A (es)
CA (1) CA1139009A (es)
DE (1) DE3071162D1 (es)
ES (1) ES8102416A1 (es)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4385202A (en) * 1980-09-25 1983-05-24 Texas Instruments Incorporated Electronic circuit interconnection system
DE3518975A1 (de) * 1985-05-25 1986-11-27 Bayer Ag, 5090 Leverkusen Kunststoffteil
US4758459A (en) * 1987-01-28 1988-07-19 Northern Telecom Limited Molded circuit board
CA2002213C (en) * 1988-11-10 1999-03-30 Iwona Turlik High performance integrated circuit chip package and method of making same
US4949453A (en) * 1989-06-15 1990-08-21 Cray Research, Inc. Method of making a chip carrier with terminating resistive elements
USRE34395E (en) * 1989-06-15 1993-10-05 Cray Research, Inc. Method of making a chip carrier with terminating resistive elements
US5122620A (en) * 1989-06-15 1992-06-16 Cray Research Inc. Chip carrier with terminating resistive elements
US5258576A (en) * 1989-06-15 1993-11-02 Cray Research, Inc. Integrated circuit chip carrier lid
US5157477A (en) * 1990-01-10 1992-10-20 International Business Machines Corporation Matched impedance vertical conductors in multilevel dielectric laminated wiring
US5098860A (en) * 1990-05-07 1992-03-24 The Boeing Company Method of fabricating high-density interconnect structures having tantalum/tantalum oxide layers
US5068715A (en) * 1990-06-29 1991-11-26 Digital Equipment Corporation High-power, high-performance integrated circuit chip package
JP2554542Y2 (ja) * 1992-02-17 1997-11-17 台灣杜邦股▲ふん▼有限公司 プリント回路基板
US5469324A (en) * 1994-10-07 1995-11-21 Storage Technology Corporation Integrated decoupling capacitive core for a printed circuit board and method of making same
JP3452678B2 (ja) * 1995-03-03 2003-09-29 三菱電機株式会社 配線構成体の製造方法
US5765279A (en) * 1995-05-22 1998-06-16 Fujitsu Limited Methods of manufacturing power supply distribution structures for multichip modules
US6266228B1 (en) 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
JP2991175B2 (ja) 1997-11-10 1999-12-20 株式会社村田製作所 積層コンデンサ
US6266229B1 (en) 1997-11-10 2001-07-24 Murata Manufacturing Co., Ltd Multilayer capacitor
US6292350B1 (en) 1997-11-10 2001-09-18 Murata Manufacturing, Co., Ltd Multilayer capacitor
US6549395B1 (en) 1997-11-14 2003-04-15 Murata Manufacturing Co., Ltd Multilayer capacitor
JP3681542B2 (ja) * 1998-07-01 2005-08-10 富士通株式会社 プリント回路基板および多段バンプ用中継基板
KR100290784B1 (ko) 1998-09-15 2001-07-12 박종섭 스택 패키지 및 그 제조방법
IL128200A (en) * 1999-01-24 2003-11-23 Amitec Advanced Multilayer Int Chip carrier substrate
US6194669B1 (en) 1999-02-05 2001-02-27 Trw Inc. Solder ball grid array for connecting multiple millimeter wave assemblies
JP3548821B2 (ja) 1999-05-10 2004-07-28 株式会社村田製作所 積層コンデンサ、ならびにこれを用いた電子装置および高周波回路
JP3476127B2 (ja) 1999-05-10 2003-12-10 株式会社村田製作所 積層コンデンサ
US6327134B1 (en) 1999-10-18 2001-12-04 Murata Manufacturing Co., Ltd. Multi-layer capacitor, wiring board, and high-frequency circuit
JP3489729B2 (ja) 1999-11-19 2004-01-26 株式会社村田製作所 積層コンデンサ、配線基板、デカップリング回路および高周波回路
WO2004004432A1 (en) * 2002-06-27 2004-01-08 Ppg Industries Ohio, Inc. Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
US20060185890A1 (en) * 2005-02-22 2006-08-24 Litton Uk Limited Air void via tuning
JP4825784B2 (ja) * 2007-12-13 2011-11-30 新光電気工業株式会社 半導体装置用パッケージおよびその製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3217089A (en) * 1962-06-01 1965-11-09 Control Data Corp Embedded printed circuit
US3299393A (en) * 1964-02-18 1967-01-17 Q T Circuits Co Electrical circuit connector
US3312870A (en) * 1964-03-13 1967-04-04 Hughes Aircraft Co Electrical transmission system
US3351816A (en) * 1965-02-04 1967-11-07 Bunker Ramo Planar coaxial circuitry
US3398232A (en) * 1965-10-19 1968-08-20 Amp Inc Circuit board with interconnected signal conductors and interconnected shielding conductors
US3519959A (en) * 1966-03-24 1970-07-07 Burroughs Corp Integral electrical power distribution network and component mounting plane
US3499219A (en) * 1967-11-06 1970-03-10 Bunker Ramo Interconnection means and method of fabrication thereof
US3530411A (en) * 1969-02-10 1970-09-22 Bunker Ramo High frequency electronic circuit structure employing planar transmission lines
US3663866A (en) * 1970-03-27 1972-05-16 Rogers Corp Back plane
US3676748A (en) * 1970-04-01 1972-07-11 Fuji Electrochemical Co Ltd Frame structures for electronic circuits
US3832769A (en) * 1971-05-26 1974-09-03 Minnesota Mining & Mfg Circuitry and method
GB1403371A (en) * 1972-01-12 1975-08-28 Mullard Ltd Semiconductor device arrangements
GB1501500A (en) * 1975-06-20 1978-02-15 Int Computers Ltd Multilayer printed circuit boards
US4237522A (en) * 1979-06-29 1980-12-02 International Business Machines Corporation Chip package with high capacitance, stacked vlsi/power sheets extending through slots in substrate

Also Published As

Publication number Publication date
JPH0143871Y2 (es) 1989-12-19
EP0021402A2 (en) 1981-01-07
JPS59125860U (ja) 1984-08-24
US4295183A (en) 1981-10-13
DE3071162D1 (en) 1985-11-14
JPS567491A (en) 1981-01-26
EP0021402B1 (en) 1985-10-09
CA1139009A (en) 1983-01-04
ES8102416A1 (es) 1980-12-16
BR8004022A (pt) 1981-01-21
EP0021402A3 (en) 1983-05-18

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