JPS5481070A - Carrier semiconductor device - Google Patents

Carrier semiconductor device

Info

Publication number
JPS5481070A
JPS5481070A JP14820377A JP14820377A JPS5481070A JP S5481070 A JPS5481070 A JP S5481070A JP 14820377 A JP14820377 A JP 14820377A JP 14820377 A JP14820377 A JP 14820377A JP S5481070 A JPS5481070 A JP S5481070A
Authority
JP
Japan
Prior art keywords
carrier
package
main body
film
beltlike
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14820377A
Other languages
Japanese (ja)
Inventor
Takashi Haraguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14820377A priority Critical patent/JPS5481070A/en
Publication of JPS5481070A publication Critical patent/JPS5481070A/en
Pending legal-status Critical Current

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  • Packages (AREA)

Abstract

PURPOSE: To make it possible to contain and support several IC packages by one carrier, and to obtain a further-improved carrier by composing the carrier of one sheet of beltlike film with an adhesive layer formed previously on one side.
CONSTITUTION: Integrated-circuit package carrier 10 is formed of beltlike insulating film 1 of a sheet of paper or plastic and in film 1, apertures 3 for accepting the main body of IC package 20, i.e. mold body 21 are made at fixed intervals. Reception hole 3 can be substituted with a groove in a U-shape, preferably the same shape as IC package main body 21, and when IC package main body 21 is set into the hole or groove 3, IC package 20 is positioned unconditionally.
COPYRIGHT: (C)1979,JPO&Japio
JP14820377A 1977-12-12 1977-12-12 Carrier semiconductor device Pending JPS5481070A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14820377A JPS5481070A (en) 1977-12-12 1977-12-12 Carrier semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14820377A JPS5481070A (en) 1977-12-12 1977-12-12 Carrier semiconductor device

Publications (1)

Publication Number Publication Date
JPS5481070A true JPS5481070A (en) 1979-06-28

Family

ID=15447556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14820377A Pending JPS5481070A (en) 1977-12-12 1977-12-12 Carrier semiconductor device

Country Status (1)

Country Link
JP (1) JPS5481070A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49133867A (en) * 1972-11-09 1974-12-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49133867A (en) * 1972-11-09 1974-12-23

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