JPS5577159A - Electronic part - Google Patents

Electronic part

Info

Publication number
JPS5577159A
JPS5577159A JP15135578A JP15135578A JPS5577159A JP S5577159 A JPS5577159 A JP S5577159A JP 15135578 A JP15135578 A JP 15135578A JP 15135578 A JP15135578 A JP 15135578A JP S5577159 A JPS5577159 A JP S5577159A
Authority
JP
Japan
Prior art keywords
salient
proper
hanging
notch
points
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15135578A
Other languages
Japanese (ja)
Inventor
Yoshihisa Ishigami
Hideki Fukusono
Hiromi Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP15135578A priority Critical patent/JPS5577159A/en
Publication of JPS5577159A publication Critical patent/JPS5577159A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Abstract

PURPOSE: To improve stability by a construction wherein a salient fixing part of elastic material is provided also on the opposite side surface to the surface with salient lead terminals so as to simply fix a print substrate to an electronic part proper at two points.
CONSTITUTION: There is a notch 4 at the center of an opposite side face 5 to the side with lead terminals 3 of the electronic part proper 1. A salient part 6 for hanging of elastic material is formed in the part of the notch. Said salient part 6 is formed en bloc in L-type from the upper surface 1a of the part proper 1 toward the under surface, having the length d about equal to the thickness of the part proper 1 and at its tip a hanging part for fixing 6a is provided. The terminals 3 are bent at a right angle to be put through the holes 7a of a print substrate while the hanging part 6a is pressed in the hole 7b to be simply fixed at two points on both sides of the part proper 1 thus for improving stability.
COPYRIGHT: (C)1980,JPO&Japio
JP15135578A 1978-12-06 1978-12-06 Electronic part Pending JPS5577159A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15135578A JPS5577159A (en) 1978-12-06 1978-12-06 Electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15135578A JPS5577159A (en) 1978-12-06 1978-12-06 Electronic part

Publications (1)

Publication Number Publication Date
JPS5577159A true JPS5577159A (en) 1980-06-10

Family

ID=15516728

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15135578A Pending JPS5577159A (en) 1978-12-06 1978-12-06 Electronic part

Country Status (1)

Country Link
JP (1) JPS5577159A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102059A (en) * 1980-12-16 1982-06-24 Mitsubishi Electric Corp Hybrid integrated circuit device
US4975763A (en) * 1988-03-14 1990-12-04 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
US5352851A (en) * 1992-09-08 1994-10-04 Texas Instruments Incorporated Edge-mounted, surface-mount integrated circuit device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102059A (en) * 1980-12-16 1982-06-24 Mitsubishi Electric Corp Hybrid integrated circuit device
JPS6161701B2 (en) * 1980-12-16 1986-12-26 Mitsubishi Electric Corp
US4975763A (en) * 1988-03-14 1990-12-04 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
US5352851A (en) * 1992-09-08 1994-10-04 Texas Instruments Incorporated Edge-mounted, surface-mount integrated circuit device

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