JPS6161701B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hybrid integrated circuit device having a package in which a heat sink is fixed to the back surface of a case housing a hybrid integrated circuit therein.

A conventional hybrid integrated circuit device of this type is shown in a perspective view in FIG. Reference numeral 1 denotes a package, which includes a case 2 in which a hybrid integrated circuit (not shown) is sealed, and a heat sink 3 fixed to the back surface of the case with adhesive or the like. This heat sink 3
is made of a metal material with good thermal conductivity, and mounting holes 3a are provided on both sides. Reference numeral 4 denotes a drawer lead taken out from one end side of the case 2.

To mount the above-mentioned conventional hybrid integrated circuit device on a printed circuit board (not shown), place it in a horizontal position on the printed circuit board as shown in Fig.
It was attached through a mounting screw (not shown). For this reason, a large mounting area was required for the printed circuit board. In addition, when mounting in such a position, the drawer leads 4 extending from the package cage 1 must be bent downward at right angles in order to be inserted and connected to the printed circuit board, which deteriorates the quality.

Furthermore, if the hybrid integrated circuit device shown in FIG. 1 is mounted on a printed circuit board in an upright state, the supporting lead leads 4 will bend or break due to the weight of the heat sink 3. In order to prevent this, conventionally, as shown in the perspective view in FIG. It was placed on a printed circuit board and mounted by passing a mounting screw (not shown) into the mounting hole 5b. In this way, in order to install the conventional device vertically, the mounting plate 5
It required

In this invention, mounting seats are provided at the bottom of both ends of the package case of a hybrid integrated circuit in an upright state, and mounting holes are drilled in the mounting seats so that the case can be mounted upright on a printed circuit board, unlike conventional It is an object of the present invention to provide a hybrid integrated circuit device that can be manufactured at low cost without bending the drawer leads and without requiring a mounting plate. Furthermore, mounting holes are formed at both ends of the heat dissipation plate fixed to the back surface of the case, and the object is to obtain a hybrid integrated circuit device that can be mounted even in a horizontal position.

FIG. 3 is a perspective view of a hybrid integrated circuit device according to an embodiment of the present invention. Reference numeral 10 denotes a package, which consists of a case 11 in which a hybrid integrated circuit (not shown) is sealed, and a heat sink 3 fixed to the back side of the case 11 with an adhesive. is shown below. The case 11 is made of synthetic resin or the like, and in an upright state, is integrally provided with mounting seats 12 that protrude from both ends of the lower part, avoiding the mounting holes 3a of the heat sink 3, and the mounting holes 12a are not drilled. There is.

The hybrid integrated circuit device of one embodiment configured as described above is mounted with the package 10 standing upright on a printed circuit board (not shown), and mounting screws passed through the mounting holes 12a.

In addition, if you want to install it horizontally due to convenience,
It is mounted using mounting screws using the mounting holes 3a of the heat dissipation plate 3.

Further, in the above embodiment, the mounting hole 12a is a cutout hole, but it may be a round hole.

As described above, according to the present invention, mounting seats are integrally provided at the bottom of both ends of the case so that the package cage can be mounted upright, so the cost can be reduced without requiring a mounting plate like in the past. . Furthermore, if necessary, the package cage can be installed in a horizontal position.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional hybrid integrated circuit device, FIG. 2 is a perspective view of the hybrid integrated circuit device of FIG. 1 standing upright and fixed to a mounting plate, and FIG. 3 is an embodiment of the present invention. FIG. 3... Heat sink, 3a... Mounting hole, 4... Drawer lead, 10... Package cage, 11... Case, 12... Mounting seat, 12a... Mounting hole. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] 1 A case that houses a hybrid integrated circuit inside, has a drawer lead coming out from one end, stands upright with the drawer lead side facing down, and has mounting seats for mounting screws integrally provided at the bottom of both ends; The package is fixed to the back of the case and includes a heat sink with mounting holes at both ends, avoiding the mounting seats, and the package can be mounted upright on a printed circuit board. hybrid integrated circuit device.