JPS6161701B2 - - Google Patents

Info

Publication number
JPS6161701B2
JPS6161701B2 JP55178247A JP17824780A JPS6161701B2 JP S6161701 B2 JPS6161701 B2 JP S6161701B2 JP 55178247 A JP55178247 A JP 55178247A JP 17824780 A JP17824780 A JP 17824780A JP S6161701 B2 JPS6161701 B2 JP S6161701B2
Authority
JP
Japan
Prior art keywords
mounting
integrated circuit
hybrid integrated
case
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55178247A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57102059A (en
Inventor
Shigeo Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55178247A priority Critical patent/JPS57102059A/ja
Publication of JPS57102059A publication Critical patent/JPS57102059A/ja
Publication of JPS6161701B2 publication Critical patent/JPS6161701B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP55178247A 1980-12-16 1980-12-16 Hybrid integrated circuit device Granted JPS57102059A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55178247A JPS57102059A (en) 1980-12-16 1980-12-16 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55178247A JPS57102059A (en) 1980-12-16 1980-12-16 Hybrid integrated circuit device

Publications (2)

Publication Number Publication Date
JPS57102059A JPS57102059A (en) 1982-06-24
JPS6161701B2 true JPS6161701B2 (enrdf_load_stackoverflow) 1986-12-26

Family

ID=16045153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55178247A Granted JPS57102059A (en) 1980-12-16 1980-12-16 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS57102059A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6139955U (ja) * 1984-08-13 1986-03-13 富士通テン株式会社 パワ−ic

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394566U (enrdf_load_stackoverflow) * 1976-12-29 1978-08-01
JPS5440060U (enrdf_load_stackoverflow) * 1977-08-24 1979-03-16
JPS5577159A (en) * 1978-12-06 1980-06-10 Matsushita Electric Works Ltd Electronic part

Also Published As

Publication number Publication date
JPS57102059A (en) 1982-06-24

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