JPS5694761A - Epoxy resin composition for semiconductor sealing - Google Patents

Epoxy resin composition for semiconductor sealing

Info

Publication number
JPS5694761A
JPS5694761A JP17248179A JP17248179A JPS5694761A JP S5694761 A JPS5694761 A JP S5694761A JP 17248179 A JP17248179 A JP 17248179A JP 17248179 A JP17248179 A JP 17248179A JP S5694761 A JPS5694761 A JP S5694761A
Authority
JP
Japan
Prior art keywords
epoxy resin
added
phenol
resin composition
hardening accelerator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17248179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS621612B2 (enExample
Inventor
Tadaharu Yoshiga
Kazuo Iko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP17248179A priority Critical patent/JPS5694761A/ja
Publication of JPS5694761A publication Critical patent/JPS5694761A/ja
Publication of JPS621612B2 publication Critical patent/JPS621612B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP17248179A 1979-12-28 1979-12-28 Epoxy resin composition for semiconductor sealing Granted JPS5694761A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17248179A JPS5694761A (en) 1979-12-28 1979-12-28 Epoxy resin composition for semiconductor sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17248179A JPS5694761A (en) 1979-12-28 1979-12-28 Epoxy resin composition for semiconductor sealing

Publications (2)

Publication Number Publication Date
JPS5694761A true JPS5694761A (en) 1981-07-31
JPS621612B2 JPS621612B2 (enExample) 1987-01-14

Family

ID=15942782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17248179A Granted JPS5694761A (en) 1979-12-28 1979-12-28 Epoxy resin composition for semiconductor sealing

Country Status (1)

Country Link
JP (1) JPS5694761A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0276247A (ja) * 1988-09-12 1990-03-15 Nitto Denko Corp 半導体装置
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5126999A (enExample) * 1974-08-29 1976-03-05 Mitsubishi Electric Corp
JPS5323273A (en) * 1976-08-13 1978-03-03 Mitsubishi Electric Corp Production of resin seal ing type semiconductor device
JPS555929A (en) * 1978-06-26 1980-01-17 Nitto Electric Ind Co Ltd Semiconductor sealing epoxy resin composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5126999A (enExample) * 1974-08-29 1976-03-05 Mitsubishi Electric Corp
JPS5323273A (en) * 1976-08-13 1978-03-03 Mitsubishi Electric Corp Production of resin seal ing type semiconductor device
JPS555929A (en) * 1978-06-26 1980-01-17 Nitto Electric Ind Co Ltd Semiconductor sealing epoxy resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0276247A (ja) * 1988-09-12 1990-03-15 Nitto Denko Corp 半導体装置
US6495270B1 (en) 1998-02-19 2002-12-17 Hitachi Chemical Company, Ltd. Compounds, hardening accelerator, resin composition, and electronic part device

Also Published As

Publication number Publication date
JPS621612B2 (enExample) 1987-01-14

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