JPS5126999A - - Google Patents
Info
- Publication number
- JPS5126999A JPS5126999A JP9925674A JP9925674A JPS5126999A JP S5126999 A JPS5126999 A JP S5126999A JP 9925674 A JP9925674 A JP 9925674A JP 9925674 A JP9925674 A JP 9925674A JP S5126999 A JPS5126999 A JP S5126999A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Epoxy Resins (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9925674A JPS5126999A (enExample) | 1974-08-29 | 1974-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9925674A JPS5126999A (enExample) | 1974-08-29 | 1974-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5126999A true JPS5126999A (enExample) | 1976-03-05 |
Family
ID=14242619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9925674A Pending JPS5126999A (enExample) | 1974-08-29 | 1974-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5126999A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5694761A (en) * | 1979-12-28 | 1981-07-31 | Nitto Electric Ind Co Ltd | Epoxy resin composition for semiconductor sealing |
| JPS6086175A (ja) * | 1983-10-19 | 1985-05-15 | Sumitomo Deyurezu Kk | エポキシ樹脂粉体塗料組成物 |
| JPS61151231A (ja) * | 1984-12-24 | 1986-07-09 | Sumitomo Bakelite Co Ltd | 液状エポキシ樹脂組成物 |
| JPH01158027A (ja) * | 1987-09-30 | 1989-06-21 | Somar Corp | 注型に好適なエポキシ樹脂組成物 |
| JPH05178966A (ja) * | 1991-12-26 | 1993-07-20 | Nippon Retsuku Kk | 硬化プリプレグ及びエポキシ樹脂組成物 |
-
1974
- 1974-08-29 JP JP9925674A patent/JPS5126999A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5694761A (en) * | 1979-12-28 | 1981-07-31 | Nitto Electric Ind Co Ltd | Epoxy resin composition for semiconductor sealing |
| JPS6086175A (ja) * | 1983-10-19 | 1985-05-15 | Sumitomo Deyurezu Kk | エポキシ樹脂粉体塗料組成物 |
| JPS61151231A (ja) * | 1984-12-24 | 1986-07-09 | Sumitomo Bakelite Co Ltd | 液状エポキシ樹脂組成物 |
| JPH01158027A (ja) * | 1987-09-30 | 1989-06-21 | Somar Corp | 注型に好適なエポキシ樹脂組成物 |
| JPH05178966A (ja) * | 1991-12-26 | 1993-07-20 | Nippon Retsuku Kk | 硬化プリプレグ及びエポキシ樹脂組成物 |