JPS5759365A - Quick hardening epoxy resin composition for sealing - Google Patents

Quick hardening epoxy resin composition for sealing

Info

Publication number
JPS5759365A
JPS5759365A JP55134569A JP13456980A JPS5759365A JP S5759365 A JPS5759365 A JP S5759365A JP 55134569 A JP55134569 A JP 55134569A JP 13456980 A JP13456980 A JP 13456980A JP S5759365 A JPS5759365 A JP S5759365A
Authority
JP
Japan
Prior art keywords
hardening
epoxy resin
resin composition
sealing
quick hardening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55134569A
Other languages
Japanese (ja)
Inventor
Tadaharu Yoshiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP55134569A priority Critical patent/JPS5759365A/en
Publication of JPS5759365A publication Critical patent/JPS5759365A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To shorten the hardening time and to improve hardening performance by including phenol novolak as a hardening agent and 2-phenyl-4-methyl imidazole as a hardening accelerator into the epoxy resin composition for sealing a semiconductor. CONSTITUTION:The epoxy resin composition includes epoxy resin, the hardening agent, the hardening accelerator, and other additives. As the hardening accelerator, 2-phenyl-4-methyl imidazole which is a sort of imidazole is used. Normally, 1-8pts.wt. or desirably, 2-6pts.wt. of said hardening accelerator are blended with 100pts.wt. of the hardening agent. In this constitution, the time of the molding process is shortened to 30-40sec, and the hardening performance such as bending strength and hardness is improved.
JP55134569A 1980-09-26 1980-09-26 Quick hardening epoxy resin composition for sealing Pending JPS5759365A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55134569A JPS5759365A (en) 1980-09-26 1980-09-26 Quick hardening epoxy resin composition for sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55134569A JPS5759365A (en) 1980-09-26 1980-09-26 Quick hardening epoxy resin composition for sealing

Publications (1)

Publication Number Publication Date
JPS5759365A true JPS5759365A (en) 1982-04-09

Family

ID=15131400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55134569A Pending JPS5759365A (en) 1980-09-26 1980-09-26 Quick hardening epoxy resin composition for sealing

Country Status (1)

Country Link
JP (1) JPS5759365A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5549719A (en) * 1990-11-14 1996-08-27 Minnesota Mining And Manufacturing Company Coated abrasive having an overcoating of an epoxy resin coatable from water
US5556437A (en) * 1990-11-14 1996-09-17 Minnesota Mining And Manufacturing Company Coated abrasive having an overcoating of an epoxy resin coatable from water

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5549719A (en) * 1990-11-14 1996-08-27 Minnesota Mining And Manufacturing Company Coated abrasive having an overcoating of an epoxy resin coatable from water
US5556437A (en) * 1990-11-14 1996-09-17 Minnesota Mining And Manufacturing Company Coated abrasive having an overcoating of an epoxy resin coatable from water

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