JPS6420271A - Coating material for ic or hybrid ic - Google Patents

Coating material for ic or hybrid ic

Info

Publication number
JPS6420271A
JPS6420271A JP15336087A JP15336087A JPS6420271A JP S6420271 A JPS6420271 A JP S6420271A JP 15336087 A JP15336087 A JP 15336087A JP 15336087 A JP15336087 A JP 15336087A JP S6420271 A JPS6420271 A JP S6420271A
Authority
JP
Japan
Prior art keywords
resin
1mol
filler
solvent
coating material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15336087A
Other languages
Japanese (ja)
Other versions
JPH075862B2 (en
Inventor
Akio Sanuki
Masatoshi Hirai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Sumitomo Durez Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Sumitomo Durez Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd, Sumitomo Durez Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP62153360A priority Critical patent/JPH075862B2/en
Publication of JPS6420271A publication Critical patent/JPS6420271A/en
Publication of JPH075862B2 publication Critical patent/JPH075862B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE:To obtain the tile coating material high in reliability and excellent in coating workability and precision of partial coating, by mixing a specified thermosetting resin with a thixotropic agent, a filler, additives and a solvent. CONSTITUTION:A resol phenol resin (a) is obtained by condensing 1mol of a phenol with at least 1mol. of formaldehyde through dehydration in the pres ence of a nitrogen compound catalyst (e.g., triethylamine). 5-20wt.% thermoset ting resin (A) comprising 45-75wt.% component (a) and 55-25wt.% epoxy resin (b) is mixed with 0.2-2.0wt.% organic thixotropic agent (B) (e.g., benzylidenesorbitol), a filler (C) (e.g., crystalline silica), a solvent (D) (e.g., tolu ene) and 0.1-2.0wt.% coupling agent (E).
JP62153360A 1986-07-18 1987-06-22 Coating material for IC or hybrid IC Expired - Fee Related JPH075862B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62153360A JPH075862B2 (en) 1986-07-18 1987-06-22 Coating material for IC or hybrid IC

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP16787686 1986-07-18
JP16787586 1986-07-18
JP22489186 1986-09-25
JP61-224891 1987-04-23
JP61-167875 1987-04-23
JP61-167876 1987-04-23
JP62-98531 1987-04-23
JP9853187 1987-04-23
JP62153360A JPH075862B2 (en) 1986-07-18 1987-06-22 Coating material for IC or hybrid IC

Publications (2)

Publication Number Publication Date
JPS6420271A true JPS6420271A (en) 1989-01-24
JPH075862B2 JPH075862B2 (en) 1995-01-25

Family

ID=27525919

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62153360A Expired - Fee Related JPH075862B2 (en) 1986-07-18 1987-06-22 Coating material for IC or hybrid IC

Country Status (1)

Country Link
JP (1) JPH075862B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03149211A (en) * 1989-11-06 1991-06-25 Murata Mfg Co Ltd Production of electronic part sealing material
JPH0931405A (en) * 1995-07-14 1997-02-04 Sumitomo Durez Co Ltd Rapidly curable dipping coating
JP2013049761A (en) * 2011-08-30 2013-03-14 Kusumoto Kasei Kk Powdery anti-sagging agent for nonaqueous anticorrosive paint and method of manufacturing the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195773A (en) * 1981-05-29 1982-12-01 Sumitomo Deyurezu Kk Powdered resin composition for electrical insulating coating
JPS5845268A (en) * 1981-09-12 1983-03-16 Nitto Electric Ind Co Ltd Heat-resistant composition for anticorrosive purpose

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57195773A (en) * 1981-05-29 1982-12-01 Sumitomo Deyurezu Kk Powdered resin composition for electrical insulating coating
JPS5845268A (en) * 1981-09-12 1983-03-16 Nitto Electric Ind Co Ltd Heat-resistant composition for anticorrosive purpose

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03149211A (en) * 1989-11-06 1991-06-25 Murata Mfg Co Ltd Production of electronic part sealing material
JPH0931405A (en) * 1995-07-14 1997-02-04 Sumitomo Durez Co Ltd Rapidly curable dipping coating
JP2013049761A (en) * 2011-08-30 2013-03-14 Kusumoto Kasei Kk Powdery anti-sagging agent for nonaqueous anticorrosive paint and method of manufacturing the same

Also Published As

Publication number Publication date
JPH075862B2 (en) 1995-01-25

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees