JPS5323273A - Production of resin seal ing type semiconductor device - Google Patents

Production of resin seal ing type semiconductor device

Info

Publication number
JPS5323273A
JPS5323273A JP9735076A JP9735076A JPS5323273A JP S5323273 A JPS5323273 A JP S5323273A JP 9735076 A JP9735076 A JP 9735076A JP 9735076 A JP9735076 A JP 9735076A JP S5323273 A JPS5323273 A JP S5323273A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
type semiconductor
resin seal
seal ing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9735076A
Other languages
Japanese (ja)
Other versions
JPS5943825B2 (en
Inventor
Susumu Yoshida
Hiroharu Niinobu
Kunihito Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP51097350A priority Critical patent/JPS5943825B2/en
Publication of JPS5323273A publication Critical patent/JPS5323273A/en
Publication of JPS5943825B2 publication Critical patent/JPS5943825B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Formation Of Insulating Films (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain resin sealing effect of high reliability by adding diazabicycloalkenes into a mixture of novolak type epoxy resin and acid anhydride whose mixing rate being reduced less than its theoretical quantities.
COPYRIGHT: (C)1978,JPO&Japio
JP51097350A 1976-08-13 1976-08-13 Manufacturing method for resin-sealed semiconductor device Expired JPS5943825B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51097350A JPS5943825B2 (en) 1976-08-13 1976-08-13 Manufacturing method for resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51097350A JPS5943825B2 (en) 1976-08-13 1976-08-13 Manufacturing method for resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS5323273A true JPS5323273A (en) 1978-03-03
JPS5943825B2 JPS5943825B2 (en) 1984-10-24

Family

ID=14190024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51097350A Expired JPS5943825B2 (en) 1976-08-13 1976-08-13 Manufacturing method for resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5943825B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694761A (en) * 1979-12-28 1981-07-31 Nitto Electric Ind Co Ltd Epoxy resin composition for semiconductor sealing
JPH02260425A (en) * 1989-03-30 1990-10-23 Toppan Printing Co Ltd Electric element and manufacture thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5694761A (en) * 1979-12-28 1981-07-31 Nitto Electric Ind Co Ltd Epoxy resin composition for semiconductor sealing
JPS621612B2 (en) * 1979-12-28 1987-01-14 Nitto Electric Ind Co
JPH02260425A (en) * 1989-03-30 1990-10-23 Toppan Printing Co Ltd Electric element and manufacture thereof

Also Published As

Publication number Publication date
JPS5943825B2 (en) 1984-10-24

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