JPS5691445A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5691445A
JPS5691445A JP16870779A JP16870779A JPS5691445A JP S5691445 A JPS5691445 A JP S5691445A JP 16870779 A JP16870779 A JP 16870779A JP 16870779 A JP16870779 A JP 16870779A JP S5691445 A JPS5691445 A JP S5691445A
Authority
JP
Japan
Prior art keywords
tantalum
electrode wiring
spattering
molybdenum
melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16870779A
Other languages
Japanese (ja)
Inventor
Masahiro Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP16870779A priority Critical patent/JPS5691445A/en
Publication of JPS5691445A publication Critical patent/JPS5691445A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To obtain a multilayer wiring of good quality by minimizing contact resistance, in the case of providing a contact between an electrode wiring and another electrode wiring using tantalum and niobium, etc., by allowing a high-melting- point metal and silicide to exist between them. CONSTITUTION:Boron ion is driven to form a source drain region 202 on an N type semiconductor substrate 201 and a gate electrode 204 is formed on a gate oxidation membrane 203 using such a substance as tantalum silicide. And then, a source drain electrode wiring 205 is formed by spattering tantalum, and surface of element is covered by a CVD silicon dioxide membrane 206. Further, the portion which is to be contacted is exposed and after spattering molybdenum 207 by approximately 5,000Angstrom , tantalum 208 is brazed by approximately 5,000Angstrom to form a multilayer wiring structure. As for the metal to be allowed to exist between them, any high- melting-point metal other than molybdenum can be used.
JP16870779A 1979-12-25 1979-12-25 Semiconductor device Pending JPS5691445A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16870779A JPS5691445A (en) 1979-12-25 1979-12-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16870779A JPS5691445A (en) 1979-12-25 1979-12-25 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5691445A true JPS5691445A (en) 1981-07-24

Family

ID=15872952

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16870779A Pending JPS5691445A (en) 1979-12-25 1979-12-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5691445A (en)

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