JPS5687342A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5687342A
JPS5687342A JP16349079A JP16349079A JPS5687342A JP S5687342 A JPS5687342 A JP S5687342A JP 16349079 A JP16349079 A JP 16349079A JP 16349079 A JP16349079 A JP 16349079A JP S5687342 A JPS5687342 A JP S5687342A
Authority
JP
Japan
Prior art keywords
silicide
injected
wafer
oxidized
oxidation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16349079A
Other languages
Japanese (ja)
Inventor
Hiroyuki Tango
Shinji Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP16349079A priority Critical patent/JPS5687342A/en
Publication of JPS5687342A publication Critical patent/JPS5687342A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To prevent metal from being deposited by silicide oxidation by a method wherein silicon is ion-injected into the silicide before the oxidation. CONSTITUTION:An Si wafer on the surface is oxidized to form SiO2 by 500Angstrom . The molybdenum silicide is attached on the SiO2 by 4000Angstrom spattering and at this stage, an Si<+> is ion-injected at 35keV in a half region of the wafer over the area of 1X10<17>/ cm<2>. After then, the wafer is applied a patterning with a mask and oxidized at 1,000 deg.C from 30min in dry O2, and then, the heat-oxidized film is removed. Thus, the region where the Si ions are injected has little molybdenum left therein due to deposition and has been put in a state that patterns are cut to the satisfaction. Simultaneously, the roughness on the surface and end face of the silicide due to the oxidation process can be prevented.
JP16349079A 1979-12-18 1979-12-18 Manufacture of semiconductor device Pending JPS5687342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16349079A JPS5687342A (en) 1979-12-18 1979-12-18 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16349079A JPS5687342A (en) 1979-12-18 1979-12-18 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5687342A true JPS5687342A (en) 1981-07-15

Family

ID=15774847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16349079A Pending JPS5687342A (en) 1979-12-18 1979-12-18 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5687342A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129471A (en) * 1983-01-14 1984-07-25 Toshiba Corp Semiconductor device and manufacture thereof
US5541131A (en) * 1991-02-01 1996-07-30 Taiwan Semiconductor Manufacturing Co. Peeling free metal silicide films using ion implantation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59129471A (en) * 1983-01-14 1984-07-25 Toshiba Corp Semiconductor device and manufacture thereof
JPH0532910B2 (en) * 1983-01-14 1993-05-18 Tokyo Shibaura Electric Co
US5541131A (en) * 1991-02-01 1996-07-30 Taiwan Semiconductor Manufacturing Co. Peeling free metal silicide films using ion implantation

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