JPS5680151A - Production of semiconductor device having plated projecting electrode - Google Patents
Production of semiconductor device having plated projecting electrodeInfo
- Publication number
- JPS5680151A JPS5680151A JP15683179A JP15683179A JPS5680151A JP S5680151 A JPS5680151 A JP S5680151A JP 15683179 A JP15683179 A JP 15683179A JP 15683179 A JP15683179 A JP 15683179A JP S5680151 A JPS5680151 A JP S5680151A
- Authority
- JP
- Japan
- Prior art keywords
- projecting
- plated
- electrode
- film
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Local Oxidation Of Silicon (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To prevent the occurrence of purple plague phenomenon and breakdown of an insulative film on a semiconductor device having a plated projecting electode by forming a protective insulating film and a projecting electrode on a semiconductor substrate having an Al wiring and securing this to a lead frame or the like to perform wire bonding, before coating the whole surfaces with a glass film. CONSTITUTION:An insulative film 24 is formed on all the semiconductor element surface provided with an Al wiring 25 expect for the part on which a projecting electrode is to be provided. A foundation metal layer 27 for plating is provided and masked with a photoresist layer 28 which has an opening corresponding to the part on which a projecting electrode is to be provided, and a plated projecting-electrode layer 29 is formed in the opening. Then the photoresist layer 28 and the unnecessary foundation metal layer 27 for plating are removed, and a wire 31 is connecte to the plated projecting-electrode layer 29. After the whole surfaces are coated with a deposition film 35 by vaporizing passivation glass, the whole is molded with resin. Said procedure can prevent the occurrence of purple plague phenomenon and breakdown of the insulative film when the Al wiring is provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15683179A JPS5680151A (en) | 1979-12-05 | 1979-12-05 | Production of semiconductor device having plated projecting electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15683179A JPS5680151A (en) | 1979-12-05 | 1979-12-05 | Production of semiconductor device having plated projecting electrode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5680151A true JPS5680151A (en) | 1981-07-01 |
Family
ID=15636297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15683179A Pending JPS5680151A (en) | 1979-12-05 | 1979-12-05 | Production of semiconductor device having plated projecting electrode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5680151A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6320845A (en) * | 1986-07-14 | 1988-01-28 | Nec Ic Microcomput Syst Ltd | Semiconductor integrated circuit |
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1979
- 1979-12-05 JP JP15683179A patent/JPS5680151A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6320845A (en) * | 1986-07-14 | 1988-01-28 | Nec Ic Microcomput Syst Ltd | Semiconductor integrated circuit |
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