JPS5674244A - Pattern forming method - Google Patents

Pattern forming method

Info

Publication number
JPS5674244A
JPS5674244A JP15181079A JP15181079A JPS5674244A JP S5674244 A JPS5674244 A JP S5674244A JP 15181079 A JP15181079 A JP 15181079A JP 15181079 A JP15181079 A JP 15181079A JP S5674244 A JPS5674244 A JP S5674244A
Authority
JP
Japan
Prior art keywords
pattern
average mol
dicarboxylic acid
weight average
pattern forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15181079A
Other languages
Japanese (ja)
Other versions
JPS6058463B2 (en
Inventor
Yasuhiro Yoneda
Tateo Kitamura
Jiro Naito
Toshisuke Kitakoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP54151810A priority Critical patent/JPS6058463B2/en
Publication of JPS5674244A publication Critical patent/JPS5674244A/en
Publication of JPS6058463B2 publication Critical patent/JPS6058463B2/en
Expired legal-status Critical Current

Links

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  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

PURPOSE: To form a minute pattern superior in resolution and resistance to dry etching, by using a specified dicarboxylic acid diallyl ester polymer as a pattern forming material.
CONSTITUTION: A dicarboxylic acid diallyl ester polymer having 5,000W50,000 weight average mol.wt. and 1W2.5 dispersion degree, that is, number average mol.wt./weight average mol.wt. ratio is selected by fractional precipitation, and this polymer is dissolved in a solvent such as 2-methoxyethyl acetate to form a resist fluid, which is coated on a substrate and dried to form a resist film. This film is exposed to electron beams or X rays in accordance with the pattern to be formed on the resist film and developed, thus permitting a grating pattern having square faces ≤μm line/1μm space to be resolved.
COPYRIGHT: (C)1981,JPO&Japio
JP54151810A 1979-11-22 1979-11-22 Pattern formation method Expired JPS6058463B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54151810A JPS6058463B2 (en) 1979-11-22 1979-11-22 Pattern formation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54151810A JPS6058463B2 (en) 1979-11-22 1979-11-22 Pattern formation method

Publications (2)

Publication Number Publication Date
JPS5674244A true JPS5674244A (en) 1981-06-19
JPS6058463B2 JPS6058463B2 (en) 1985-12-20

Family

ID=15526798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54151810A Expired JPS6058463B2 (en) 1979-11-22 1979-11-22 Pattern formation method

Country Status (1)

Country Link
JP (1) JPS6058463B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017169661A1 (en) * 2016-03-31 2017-10-05 株式会社大阪ソーダ Photocurable resin composition and cured product of same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017169661A1 (en) * 2016-03-31 2017-10-05 株式会社大阪ソーダ Photocurable resin composition and cured product of same
JPWO2017169661A1 (en) * 2016-03-31 2019-02-14 株式会社大阪ソーダ Photocurable resin composition and cured product thereof

Also Published As

Publication number Publication date
JPS6058463B2 (en) 1985-12-20

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