JPS5672196A - Bright plating bath for copper-tin alloy - Google Patents
Bright plating bath for copper-tin alloyInfo
- Publication number
- JPS5672196A JPS5672196A JP15053079A JP15053079A JPS5672196A JP S5672196 A JPS5672196 A JP S5672196A JP 15053079 A JP15053079 A JP 15053079A JP 15053079 A JP15053079 A JP 15053079A JP S5672196 A JPS5672196 A JP S5672196A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- plating bath
- tin
- bath
- tin alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 6
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 title abstract 4
- -1 alkali metal pyrophosphate Chemical class 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 235000011180 diphosphates Nutrition 0.000 abstract 2
- 239000004372 Polyvinyl alcohol Substances 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 229910052783 alkali metal Inorganic materials 0.000 abstract 1
- 239000002738 chelating agent Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 150000001879 copper Chemical class 0.000 abstract 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229920002451 polyvinyl alcohol Polymers 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 229920003169 water-soluble polymer Polymers 0.000 abstract 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15053079A JPS5672196A (en) | 1979-11-19 | 1979-11-19 | Bright plating bath for copper-tin alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15053079A JPS5672196A (en) | 1979-11-19 | 1979-11-19 | Bright plating bath for copper-tin alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5672196A true JPS5672196A (en) | 1981-06-16 |
| JPS639032B2 JPS639032B2 (enrdf_load_stackoverflow) | 1988-02-25 |
Family
ID=15498880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15053079A Granted JPS5672196A (en) | 1979-11-19 | 1979-11-19 | Bright plating bath for copper-tin alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5672196A (enrdf_load_stackoverflow) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1051584C (zh) * | 1995-11-10 | 2000-04-19 | 唐文海 | 青铜镀液及其制备方法与应用 |
| JP2001295092A (ja) * | 2000-04-14 | 2001-10-26 | Nippon New Chrome Kk | 銅−スズ合金めっき用ピロリン酸浴 |
| EP1300486A1 (en) * | 2001-10-02 | 2003-04-09 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| JP2005537394A (ja) * | 2002-10-11 | 2005-12-08 | エンソーン インコーポレイテッド | ブロンズ電析法 |
| JP2006213996A (ja) * | 2005-02-07 | 2006-08-17 | Fcm Kk | Ｓｎ−Ａｇ−Ｃｕ三元合金薄膜を形成する方法 |
| US7563353B2 (en) | 2004-10-21 | 2009-07-21 | Fcm Co., Ltd. | Method of forming Sn-Ag-Cu ternary alloy thin-film on base material |
| KR20110039460A (ko) * | 2008-07-15 | 2011-04-18 | 엔쏜 인코포레이티드 | 구리 층의 갈바닉 침착을 위한 시안화물-무함유 전해질 조성물 |
| JP2014156643A (ja) * | 2013-02-18 | 2014-08-28 | Shimizu:Kk | 非シアン銅−錫合金めっき浴 |
| CN104152955A (zh) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | 碱性溶液电镀光亮白铜锡电镀液及工艺 |
| CN112323109A (zh) * | 2020-10-31 | 2021-02-05 | 重庆望江工业有限公司 | 一种用于低锡合金的无氰镀液及制备方法 |
-
1979
- 1979-11-19 JP JP15053079A patent/JPS5672196A/ja active Granted
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1051584C (zh) * | 1995-11-10 | 2000-04-19 | 唐文海 | 青铜镀液及其制备方法与应用 |
| JP2001295092A (ja) * | 2000-04-14 | 2001-10-26 | Nippon New Chrome Kk | 銅−スズ合金めっき用ピロリン酸浴 |
| EP1300486A1 (en) * | 2001-10-02 | 2003-04-09 | Shipley Co. L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6652731B2 (en) | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| JP2005537394A (ja) * | 2002-10-11 | 2005-12-08 | エンソーン インコーポレイテッド | ブロンズ電析法 |
| US7563353B2 (en) | 2004-10-21 | 2009-07-21 | Fcm Co., Ltd. | Method of forming Sn-Ag-Cu ternary alloy thin-film on base material |
| JP2006213996A (ja) * | 2005-02-07 | 2006-08-17 | Fcm Kk | Ｓｎ−Ａｇ−Ｃｕ三元合金薄膜を形成する方法 |
| KR20110039460A (ko) * | 2008-07-15 | 2011-04-18 | 엔쏜 인코포레이티드 | 구리 층의 갈바닉 침착을 위한 시안화물-무함유 전해질 조성물 |
| JP2011528406A (ja) * | 2008-07-15 | 2011-11-17 | エントン インコーポレイテッド | 銅層のガルバニック堆積のための無シアン化物電解質組成物 |
| JP2014156643A (ja) * | 2013-02-18 | 2014-08-28 | Shimizu:Kk | 非シアン銅−錫合金めっき浴 |
| CN104152955A (zh) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | 碱性溶液电镀光亮白铜锡电镀液及工艺 |
| CN112323109A (zh) * | 2020-10-31 | 2021-02-05 | 重庆望江工业有限公司 | 一种用于低锡合金的无氰镀液及制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS639032B2 (enrdf_load_stackoverflow) | 1988-02-25 |
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