JPS5671929A - Treatment for silicon substrate - Google Patents
Treatment for silicon substrateInfo
- Publication number
- JPS5671929A JPS5671929A JP14870579A JP14870579A JPS5671929A JP S5671929 A JPS5671929 A JP S5671929A JP 14870579 A JP14870579 A JP 14870579A JP 14870579 A JP14870579 A JP 14870579A JP S5671929 A JPS5671929 A JP S5671929A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- distortion
- layers
- epitaxial growth
- microdefects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE:To minimize microdefects generating on an epitaxial growth surface by forming mechanical distortion layers on the reverse side of a substrate when an epitaxial layer is grown on the surface of a semiconductor substrate wherein heat treatment is applied in a dry oxide atmosphere at 700-1,000 deg.C. CONSTITUTION:Distortion 4 is intentionally formed on the reverse side of a semiconductor substrate 1 making epitaxial growth by a mechanical means. And heat treatment is applied to the substrate 1 at 700-1,000 deg.C for 10-60hr under a dry oxide atmosphere to generate defective layers 5 in the substrate 1. Next, an SiO2 film on the substrate 1 surface grown with the defective layers 5 is removed and the substrate 1 is housed in an epitaxial growth furnace to grow an epitaxial layer 2 by guiding H2 carrier gas and SiH4 gas. In this way, it is possible to remarkably decrease the density of microdefects 3 generating on the layer 2 surface as low as -2X10<3> pieces/cm<2> by gettering geometric effect with the sink by the distortion 4 and the sink of the defective layers 5 by low temperature oxidation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14870579A JPS5671929A (en) | 1979-11-16 | 1979-11-16 | Treatment for silicon substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14870579A JPS5671929A (en) | 1979-11-16 | 1979-11-16 | Treatment for silicon substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5671929A true JPS5671929A (en) | 1981-06-15 |
Family
ID=15458745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14870579A Pending JPS5671929A (en) | 1979-11-16 | 1979-11-16 | Treatment for silicon substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5671929A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03116820A (en) * | 1989-09-29 | 1991-05-17 | Shin Etsu Handotai Co Ltd | Misfit transposition control method |
JPH04267339A (en) * | 1991-02-21 | 1992-09-22 | Toshiba Corp | Semiconductor substrate and its manufacture |
-
1979
- 1979-11-16 JP JP14870579A patent/JPS5671929A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03116820A (en) * | 1989-09-29 | 1991-05-17 | Shin Etsu Handotai Co Ltd | Misfit transposition control method |
JPH04267339A (en) * | 1991-02-21 | 1992-09-22 | Toshiba Corp | Semiconductor substrate and its manufacture |
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