JPS5651841A - Forming method for metal film pattern - Google Patents
Forming method for metal film patternInfo
- Publication number
- JPS5651841A JPS5651841A JP12778679A JP12778679A JPS5651841A JP S5651841 A JPS5651841 A JP S5651841A JP 12778679 A JP12778679 A JP 12778679A JP 12778679 A JP12778679 A JP 12778679A JP S5651841 A JPS5651841 A JP S5651841A
- Authority
- JP
- Japan
- Prior art keywords
- film
- steps
- portions
- metal film
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Drying Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To permit metal film patterns having extremely narrow pattern intervals to be formed by using steep steps formed on a substrate to selectively remove the metal film portions near the steps at narrow widths. CONSTITUTION:An Si substrate 1 is coated with an SiO2 film 2, in which contact holes 3 are made. Then, by using a resist film 4, steep steps 5 are formed on the film 2 in the pattern-separating regions. After the film 4 is removed, the whole surface is coated with a metal film, e.g., Al film 6. On doing this, Al film portions 6a near the steps 5 become ones each having a fairly lower density and worse state in film quality than those on the other regions, and therefore the etching speed of the portions 6a is several to several tens of times faster than the Al film portions on the other regions. After that, the whole surface of the film 6 is etched to remove all the Al film portions 6a near the steps 5. Thus, Al wirings 7 connected to the substrate 1 through the holes are formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12778679A JPS5651841A (en) | 1979-10-03 | 1979-10-03 | Forming method for metal film pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12778679A JPS5651841A (en) | 1979-10-03 | 1979-10-03 | Forming method for metal film pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5651841A true JPS5651841A (en) | 1981-05-09 |
Family
ID=14968639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12778679A Pending JPS5651841A (en) | 1979-10-03 | 1979-10-03 | Forming method for metal film pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5651841A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60133927A (en) * | 1983-12-21 | 1985-07-17 | Kawasaki Steel Corp | Control method of breakdown mill |
-
1979
- 1979-10-03 JP JP12778679A patent/JPS5651841A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60133927A (en) * | 1983-12-21 | 1985-07-17 | Kawasaki Steel Corp | Control method of breakdown mill |
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