JPS5630735A - Wire-bonding device - Google Patents

Wire-bonding device

Info

Publication number
JPS5630735A
JPS5630735A JP10624979A JP10624979A JPS5630735A JP S5630735 A JPS5630735 A JP S5630735A JP 10624979 A JP10624979 A JP 10624979A JP 10624979 A JP10624979 A JP 10624979A JP S5630735 A JPS5630735 A JP S5630735A
Authority
JP
Japan
Prior art keywords
arm
coil
currents
capillary
swing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10624979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6243336B2 (enrdf_load_stackoverflow
Inventor
Osamu Nakayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10624979A priority Critical patent/JPS5630735A/ja
Publication of JPS5630735A publication Critical patent/JPS5630735A/ja
Publication of JPS6243336B2 publication Critical patent/JPS6243336B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP10624979A 1979-08-21 1979-08-21 Wire-bonding device Granted JPS5630735A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10624979A JPS5630735A (en) 1979-08-21 1979-08-21 Wire-bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10624979A JPS5630735A (en) 1979-08-21 1979-08-21 Wire-bonding device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP63170179A Division JPH01144642A (ja) 1988-07-08 1988-07-08 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS5630735A true JPS5630735A (en) 1981-03-27
JPS6243336B2 JPS6243336B2 (enrdf_load_stackoverflow) 1987-09-12

Family

ID=14428821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10624979A Granted JPS5630735A (en) 1979-08-21 1979-08-21 Wire-bonding device

Country Status (1)

Country Link
JP (1) JPS5630735A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58199535A (ja) * 1982-05-17 1983-11-19 Shinkawa Ltd ボンデイングア−ムの上下駆動装置
JPS59130433A (ja) * 1983-01-17 1984-07-27 Toshiba Corp ワイヤボンディング装置
JPS6167927A (ja) * 1984-09-12 1986-04-08 Toshiba Corp ワイヤボンディング装置及びワイヤボンディング方法
JPS6230341A (ja) * 1985-07-31 1987-02-09 Fujitsu Ltd ワイヤボンデイング方法
JPS62214629A (ja) * 1986-03-17 1987-09-21 Hitachi Tokyo Electron Co Ltd ワイヤボンディング装置
JPH0357231A (ja) * 1989-07-25 1991-03-12 Nec Corp ワイヤボンディング装置
JPH04363037A (ja) * 1991-09-20 1992-12-15 Nec Corp ワイヤボンディング装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS521435A (en) * 1975-06-24 1977-01-07 Hitachi Ltd A.c. load disconnection detecting device
JPS5214352A (en) * 1975-07-25 1977-02-03 Hitachi Ltd Equipment for wirebonding
JPS52143946A (en) * 1976-05-26 1977-11-30 Hitachi Ltd Mechanism for elevationally moving bonding arm

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS521435A (en) * 1975-06-24 1977-01-07 Hitachi Ltd A.c. load disconnection detecting device
JPS5214352A (en) * 1975-07-25 1977-02-03 Hitachi Ltd Equipment for wirebonding
JPS52143946A (en) * 1976-05-26 1977-11-30 Hitachi Ltd Mechanism for elevationally moving bonding arm

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58199535A (ja) * 1982-05-17 1983-11-19 Shinkawa Ltd ボンデイングア−ムの上下駆動装置
JPS59130433A (ja) * 1983-01-17 1984-07-27 Toshiba Corp ワイヤボンディング装置
JPS6167927A (ja) * 1984-09-12 1986-04-08 Toshiba Corp ワイヤボンディング装置及びワイヤボンディング方法
JPS6230341A (ja) * 1985-07-31 1987-02-09 Fujitsu Ltd ワイヤボンデイング方法
JPS62214629A (ja) * 1986-03-17 1987-09-21 Hitachi Tokyo Electron Co Ltd ワイヤボンディング装置
JPH0357231A (ja) * 1989-07-25 1991-03-12 Nec Corp ワイヤボンディング装置
JPH04363037A (ja) * 1991-09-20 1992-12-15 Nec Corp ワイヤボンディング装置

Also Published As

Publication number Publication date
JPS6243336B2 (enrdf_load_stackoverflow) 1987-09-12

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