JPS57154847A - Operating mechanism for tool - Google Patents

Operating mechanism for tool

Info

Publication number
JPS57154847A
JPS57154847A JP56039408A JP3940881A JPS57154847A JP S57154847 A JPS57154847 A JP S57154847A JP 56039408 A JP56039408 A JP 56039408A JP 3940881 A JP3940881 A JP 3940881A JP S57154847 A JPS57154847 A JP S57154847A
Authority
JP
Japan
Prior art keywords
tool
voice coil
bonding arm
potentiometer
operating mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56039408A
Other languages
Japanese (ja)
Inventor
Kenji Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56039408A priority Critical patent/JPS57154847A/en
Publication of JPS57154847A publication Critical patent/JPS57154847A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344Eccentric cams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To control and vary the operation of the tool easily in response to every kind of parameters by forming the operating mechanism by a direct-acting type driving device, to which the tool is mounted, and an operation controller controlling the operation of the driving device.
CONSTITUTION: A voice coil 14 directly moving vertically along a magnetic shaft 16 is mounted. A bonding arm 12 is directly set up to the frame section of the lower section of the voice coil 14 in the horizontal direction. A shaft for stopping the turn of the bonding arm 12 and the tool 10 is inserted into a hole formed near the central section of the bonding arm 12. A potentiometer 20 is mounted at the magnetic shaft 16 side in the vertical direction. A detecting pin 22 for detecting a position is attached to the lower section of the voice coil 14. The tip of the detecting pin 22 is brought close to the potentiometer 20.
COPYRIGHT: (C)1982,JPO&Japio
JP56039408A 1981-03-20 1981-03-20 Operating mechanism for tool Pending JPS57154847A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56039408A JPS57154847A (en) 1981-03-20 1981-03-20 Operating mechanism for tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56039408A JPS57154847A (en) 1981-03-20 1981-03-20 Operating mechanism for tool

Publications (1)

Publication Number Publication Date
JPS57154847A true JPS57154847A (en) 1982-09-24

Family

ID=12552159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56039408A Pending JPS57154847A (en) 1981-03-20 1981-03-20 Operating mechanism for tool

Country Status (1)

Country Link
JP (1) JPS57154847A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09510834A (en) * 1994-05-19 1997-10-28 フィン,デイヴィット Wiring device pulling up and guiding device
US9557119B2 (en) 2009-05-08 2017-01-31 Arvos Inc. Heat transfer sheet for rotary regenerative heat exchanger

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09510834A (en) * 1994-05-19 1997-10-28 フィン,デイヴィット Wiring device pulling up and guiding device
US9557119B2 (en) 2009-05-08 2017-01-31 Arvos Inc. Heat transfer sheet for rotary regenerative heat exchanger

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