JPS5627944A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5627944A
JPS5627944A JP10282679A JP10282679A JPS5627944A JP S5627944 A JPS5627944 A JP S5627944A JP 10282679 A JP10282679 A JP 10282679A JP 10282679 A JP10282679 A JP 10282679A JP S5627944 A JPS5627944 A JP S5627944A
Authority
JP
Japan
Prior art keywords
film
metal
wiring
etched
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10282679A
Other languages
Japanese (ja)
Inventor
Mutsunobu Arita
Masaaki Sato
Masahiko Maeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP10282679A priority Critical patent/JPS5627944A/en
Publication of JPS5627944A publication Critical patent/JPS5627944A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To form multilayered wiring whose surface is flat by laminating the insulating layers whose etching rates are different; thereafter opening a hole, side-etching the lower layer, depositing a metal film, and forming a metal wiring by employing the lift-off method. CONSTITUTION:An oxide film 6, semiconductor layers 4 and 5 are formed on a substrate 1 on which element is formed. Then, an SiO2 film 7, a metal 8, and a nitride film 9 are formed, and a hole is opened by the photoetching. At this time, the nitride film 9 and the SiO2 film 7 are vertically etched by the sputter etching, and the metal film 8 is side-etched in liquid. Then Al is evaporated in a vacuum, the metal film 8 is etched out, unnecessary Al is lifted off, and an Al electrode 11 is formed. The same process is repeated and the multilayered wiring is formed. In this method, the metal wiring layer whose surface is flat is realized, and the multilayered wiring with a high density and a high yield rate can be formed.
JP10282679A 1979-08-14 1979-08-14 Manufacture of semiconductor device Pending JPS5627944A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10282679A JPS5627944A (en) 1979-08-14 1979-08-14 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10282679A JPS5627944A (en) 1979-08-14 1979-08-14 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5627944A true JPS5627944A (en) 1981-03-18

Family

ID=14337818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10282679A Pending JPS5627944A (en) 1979-08-14 1979-08-14 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5627944A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127349A (en) * 1982-01-25 1983-07-29 Hitachi Ltd Preparation of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127349A (en) * 1982-01-25 1983-07-29 Hitachi Ltd Preparation of semiconductor device

Similar Documents

Publication Publication Date Title
JPS55163860A (en) Manufacture of semiconductor device
JPS6414949A (en) Semiconductor device and manufacture of the same
US4563695A (en) Superconducting switching device
GB1358438A (en) Process for the manufacture of a semiconductor component or an integrated semiconductor circuit
JPS5627944A (en) Manufacture of semiconductor device
JPS6430272A (en) Thin film transistor
JPS5730376A (en) Manufacture of schottky barrier fet
EP0088808B1 (en) Process for producing niobium josephson junctions
JPS57145340A (en) Manufacture of semiconductor device
JPS6457717A (en) Manufacture of semiconductor device
JPS6459936A (en) Manufacture of integrated circuit
GB1495377A (en) Method of manufacturing a charge transfer device
JPS6430228A (en) Manufacture of semiconductor device
JPS56148845A (en) Manufacture of semiconductor device
JPS6431453A (en) Manufacture of semiconductor device
JPS56147434A (en) Manufacture of semiconductor device
JPS5458389A (en) Forming method of polyimide film in semiconductor device
JPS6423554A (en) Semiconductor device and manufacture thereof
JPS54116894A (en) Superconduction circuit device
JPS572545A (en) Manufacture of semiconductor device
JPS57202758A (en) Semiconductor device
JPS56144553A (en) Manufacture of semiconductor device
JPS6453467A (en) Formation of miniaturized pattern
JPS57164563A (en) Manufacture of semiconductor device
GB1361357A (en) Production of semiconductor devices