JPS56169359A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS56169359A JPS56169359A JP7351980A JP7351980A JPS56169359A JP S56169359 A JPS56169359 A JP S56169359A JP 7351980 A JP7351980 A JP 7351980A JP 7351980 A JP7351980 A JP 7351980A JP S56169359 A JPS56169359 A JP S56169359A
- Authority
- JP
- Japan
- Prior art keywords
- type
- mask
- integrated circuit
- steps
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 230000003071 parasitic effect Effects 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 230000000295 complement effect Effects 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0623—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Abstract
PURPOSE:To effectively prevent a latch-up of a semiconductor integrated circuit device due to a parasitic element by performing the steps of isolating elements and forming of a well with one mask in one step when providing a bipolar transistor and a complementary FET on the same substrate and reducing the number of steps. CONSTITUTION:When N<+> type layers 102, 103 are buried in a P type Si substrate 100, an N type epitaxial layer 104 is superposed thereon and N type wells 105, 106 are respectively formed via SiO2 mask 71 on the buried layers, they are isolated with the layer 104, the steps can be remarkably simplified as compared with the conventional process inexpensively and readily. Then, a mask 81 is formed, and P<+> type base 107, source 108, drain 109, and channels 111, 112 are formed. Then, a mask 91 is formed, N<+> type emitter 113, source 114, drain 115, and connecting layer 116 are formed, a gate oxidized film 119 and a gate electrode 120 are eventually formed, and prescribed electrodes 120-126 are then formed to complete the integrated circuit. According to this configuration, since the base width of the parasitic element with the layers 114-104-103 is large, its hfe is small and its latch- up can be effectively prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7351980A JPS56169359A (en) | 1980-05-30 | 1980-05-30 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7351980A JPS56169359A (en) | 1980-05-30 | 1980-05-30 | Semiconductor integrated circuit device |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58226204A Division JPS59188162A (en) | 1983-11-29 | 1983-11-29 | Semiconductor integrated circuit device |
JP8545890A Division JPH0316166A (en) | 1990-03-31 | 1990-03-31 | Semiconductor integrated circuit device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56169359A true JPS56169359A (en) | 1981-12-26 |
JPH0427707B2 JPH0427707B2 (en) | 1992-05-12 |
Family
ID=13520567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7351980A Granted JPS56169359A (en) | 1980-05-30 | 1980-05-30 | Semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56169359A (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57206064A (en) * | 1981-06-15 | 1982-12-17 | Toshiba Corp | Semiconductor device and manufacturing method therefor |
JPS57206063A (en) * | 1981-06-15 | 1982-12-17 | Toshiba Corp | Semiconductor substrate and manufacture therefor |
JPS58170048A (en) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | Semiconductor device |
JPS58182863A (en) * | 1982-04-21 | 1983-10-25 | Hitachi Ltd | Semiconductor device |
JPS58225663A (en) * | 1982-06-23 | 1983-12-27 | Toshiba Corp | Manufacture of semiconductor device |
JPS6080267A (en) * | 1983-10-07 | 1985-05-08 | Toshiba Corp | Semiconductor ic device and manufacture thereof |
JPS6097661A (en) * | 1983-11-02 | 1985-05-31 | Hitachi Ltd | Semiconductor integrated circuit device |
JPS60101963A (en) * | 1983-11-08 | 1985-06-06 | Iwatsu Electric Co Ltd | Manufacture of complementary type filed effect transistor |
JPS60218866A (en) * | 1984-04-13 | 1985-11-01 | Mitsubishi Electric Corp | Complementary mos semiconductor device |
JPS6325964A (en) * | 1987-02-13 | 1988-02-03 | Seiko Epson Corp | Cmos type semiconductor integrated circuit device |
JPS63278265A (en) * | 1986-11-04 | 1988-11-15 | サムスン エレクトロニクス カンパニー リミテッド | Manufacture of semiconductor bicmos device |
JPS63301545A (en) * | 1987-05-30 | 1988-12-08 | Ricoh Co Ltd | Manufacture of semiconductor integrated circuit device |
-
1980
- 1980-05-30 JP JP7351980A patent/JPS56169359A/en active Granted
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57206063A (en) * | 1981-06-15 | 1982-12-17 | Toshiba Corp | Semiconductor substrate and manufacture therefor |
JPS57206064A (en) * | 1981-06-15 | 1982-12-17 | Toshiba Corp | Semiconductor device and manufacturing method therefor |
JPS58170048A (en) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | Semiconductor device |
JPS58182863A (en) * | 1982-04-21 | 1983-10-25 | Hitachi Ltd | Semiconductor device |
JPH0481341B2 (en) * | 1982-04-21 | 1992-12-22 | Hitachi Ltd | |
JPS58225663A (en) * | 1982-06-23 | 1983-12-27 | Toshiba Corp | Manufacture of semiconductor device |
JPH0315346B2 (en) * | 1983-10-07 | 1991-02-28 | Tokyo Shibaura Electric Co | |
JPS6080267A (en) * | 1983-10-07 | 1985-05-08 | Toshiba Corp | Semiconductor ic device and manufacture thereof |
JPS6097661A (en) * | 1983-11-02 | 1985-05-31 | Hitachi Ltd | Semiconductor integrated circuit device |
JPS60101963A (en) * | 1983-11-08 | 1985-06-06 | Iwatsu Electric Co Ltd | Manufacture of complementary type filed effect transistor |
JPS60218866A (en) * | 1984-04-13 | 1985-11-01 | Mitsubishi Electric Corp | Complementary mos semiconductor device |
JPS63278265A (en) * | 1986-11-04 | 1988-11-15 | サムスン エレクトロニクス カンパニー リミテッド | Manufacture of semiconductor bicmos device |
JPS6325964A (en) * | 1987-02-13 | 1988-02-03 | Seiko Epson Corp | Cmos type semiconductor integrated circuit device |
JPS63301545A (en) * | 1987-05-30 | 1988-12-08 | Ricoh Co Ltd | Manufacture of semiconductor integrated circuit device |
Also Published As
Publication number | Publication date |
---|---|
JPH0427707B2 (en) | 1992-05-12 |
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