JPS56167353A - Pressure-welding type semiconductor device - Google Patents

Pressure-welding type semiconductor device

Info

Publication number
JPS56167353A
JPS56167353A JP7057380A JP7057380A JPS56167353A JP S56167353 A JPS56167353 A JP S56167353A JP 7057380 A JP7057380 A JP 7057380A JP 7057380 A JP7057380 A JP 7057380A JP S56167353 A JPS56167353 A JP S56167353A
Authority
JP
Japan
Prior art keywords
ring
pressure
positioning
section
circumferential wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7057380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6127901B2 (enrdf_load_stackoverflow
Inventor
Yuzuru Konishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7057380A priority Critical patent/JPS56167353A/ja
Publication of JPS56167353A publication Critical patent/JPS56167353A/ja
Publication of JPS6127901B2 publication Critical patent/JPS6127901B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP7057380A 1980-05-26 1980-05-26 Pressure-welding type semiconductor device Granted JPS56167353A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7057380A JPS56167353A (en) 1980-05-26 1980-05-26 Pressure-welding type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7057380A JPS56167353A (en) 1980-05-26 1980-05-26 Pressure-welding type semiconductor device

Publications (2)

Publication Number Publication Date
JPS56167353A true JPS56167353A (en) 1981-12-23
JPS6127901B2 JPS6127901B2 (enrdf_load_stackoverflow) 1986-06-27

Family

ID=13435423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7057380A Granted JPS56167353A (en) 1980-05-26 1980-05-26 Pressure-welding type semiconductor device

Country Status (1)

Country Link
JP (1) JPS56167353A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998043301A1 (fr) * 1997-03-26 1998-10-01 Hitachi, Ltd. Dispositif plat a semi-conducteur et convertisseur de courant utilisant ce dernier

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4727471B2 (ja) * 2006-03-22 2011-07-20 株式会社豊田中央研究所 半導体装置
DE102018130019B4 (de) * 2018-11-27 2021-02-25 Azl Aachen Gmbh Vorrichtung zur pressenden Bearbeitung von Flachmaterial

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998043301A1 (fr) * 1997-03-26 1998-10-01 Hitachi, Ltd. Dispositif plat a semi-conducteur et convertisseur de courant utilisant ce dernier

Also Published As

Publication number Publication date
JPS6127901B2 (enrdf_load_stackoverflow) 1986-06-27

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