JPS56164585A - Pickup device for solid-state image - Google Patents

Pickup device for solid-state image

Info

Publication number
JPS56164585A
JPS56164585A JP6780280A JP6780280A JPS56164585A JP S56164585 A JPS56164585 A JP S56164585A JP 6780280 A JP6780280 A JP 6780280A JP 6780280 A JP6780280 A JP 6780280A JP S56164585 A JPS56164585 A JP S56164585A
Authority
JP
Japan
Prior art keywords
section
metal plate
constitution
short
separated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6780280A
Other languages
Japanese (ja)
Inventor
Yuichi Shimizu
Yoshio Iwata
Tsunehisa Horiuchi
Tsutomu Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6780280A priority Critical patent/JPS56164585A/en
Publication of JPS56164585A publication Critical patent/JPS56164585A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

PURPOSE:To prevent the short-circuit as well as to contrive to improve the rliability for the subject device by a method wherein a metal plate is separated into a semiconductor element mounted section and a guide hole formed section. CONSTITUTION:A cobalt plate 8 is adhered on the entire surface of the bottom face of a ceramic frame material 7, a gap d is formed by means of an etching and the like, is separated into plates 8 and 8b, and are electrically insulated. According to this constitution, the area of the element mounting section 8 on the metal plate 8 is reduced and at the same time, no voltage is applied to the section 8b having guide holes 10 and 11. As a result, the short-circuit generating between an outer lead terminal 4, sockets and the like, and the metal plate 8 can be prevented and the reliability of the device can be improved.
JP6780280A 1980-05-23 1980-05-23 Pickup device for solid-state image Pending JPS56164585A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6780280A JPS56164585A (en) 1980-05-23 1980-05-23 Pickup device for solid-state image

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6780280A JPS56164585A (en) 1980-05-23 1980-05-23 Pickup device for solid-state image

Publications (1)

Publication Number Publication Date
JPS56164585A true JPS56164585A (en) 1981-12-17

Family

ID=13355436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6780280A Pending JPS56164585A (en) 1980-05-23 1980-05-23 Pickup device for solid-state image

Country Status (1)

Country Link
JP (1) JPS56164585A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161187A (en) * 1983-03-04 1984-09-11 Hitachi Ltd Solid-state image pickup device
JPS6234447U (en) * 1985-08-20 1987-02-28
EP0300590A2 (en) * 1987-07-22 1989-01-25 Director General, Agency of Industrial Science and Technology Semiconductor device package structure
JP2015050557A (en) * 2013-08-30 2015-03-16 京セラ株式会社 Substrate for mounting image sensor and imaging apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161187A (en) * 1983-03-04 1984-09-11 Hitachi Ltd Solid-state image pickup device
JPS6234447U (en) * 1985-08-20 1987-02-28
EP0300590A2 (en) * 1987-07-22 1989-01-25 Director General, Agency of Industrial Science and Technology Semiconductor device package structure
JP2015050557A (en) * 2013-08-30 2015-03-16 京セラ株式会社 Substrate for mounting image sensor and imaging apparatus

Similar Documents

Publication Publication Date Title
US4249196A (en) Integrated circuit module with integral capacitor
KR100190800B1 (en) Photovoltaic device and method of manufacturing the same
JPS6428930A (en) Semiconductor device
JPS6411357A (en) Method of taking out lead of semiconductor chip component
JPS56164585A (en) Pickup device for solid-state image
JPS5346290A (en) Semiconductor device
GB1157479A (en) A Magnetostriction Device.
JPS5739571A (en) Constant current diode
EP0140130A3 (en) Process and apparatus for preparing semiconductor layer
JPS575366A (en) Semiconductor device and manufacture thereof
JPS5481073A (en) Sealing method for semiconductor element
JPS56166392A (en) Partial plating jig
JPS56167353A (en) Pressure-welding type semiconductor device
JPS554988A (en) Semiconductor device
JPS5365685A (en) Piezoelectric oscillator
JPS52108774A (en) Fitting material for integrated circuit
JPS6484407A (en) Manufacture of thin film magnetic head
JPS6449249A (en) Resin sealed semiconductor device
JPS53146340A (en) Heating element
ATE70926T1 (en) DEVICE FOR CHANGING THE STATIC, ELECTRICAL POTENTIAL BY CORONA DISCHARGE ON THE SURFACE MADE OF INSULATING MATERIAL OF A MOVING ELEMENT.
JPS5287979A (en) Semiconductor device
JPS57194560A (en) Lead frame
JPS5365063A (en) Semiconductor device
JPS56137664A (en) Lead frame and semiconductor device having lead frame
JPS574160A (en) Semiconductor device