JPS56163073A - Soldering device - Google Patents

Soldering device

Info

Publication number
JPS56163073A
JPS56163073A JP6630780A JP6630780A JPS56163073A JP S56163073 A JPS56163073 A JP S56163073A JP 6630780 A JP6630780 A JP 6630780A JP 6630780 A JP6630780 A JP 6630780A JP S56163073 A JPS56163073 A JP S56163073A
Authority
JP
Japan
Prior art keywords
soldering
tank
solder flow
conveying direction
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6630780A
Other languages
Japanese (ja)
Other versions
JPS5744434B2 (en
Inventor
Takeshi Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP6630780A priority Critical patent/JPS56163073A/en
Priority to KR1019810001671A priority patent/KR840001731B1/en
Publication of JPS56163073A publication Critical patent/JPS56163073A/en
Publication of JPS5744434B2 publication Critical patent/JPS5744434B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

PURPOSE:To perform good soldering free from any miss by juxtaposing the 1st soldering tank which produces solder flow in the conveying direction of printed substrates and has means of accelerating this, and the 2nd soldering tank which produces solder flow in the direction opposite from the conveying direction of the substrates, and performing continuous soldering in both soldering tanks. CONSTITUTION:This is a device for soldering between prescribed conductor parts on a printed substrate 12 packaged with electric parts. This device is juxtaposed with the 1st soldering tank 105 and the 2nd soldering tank 102. When the fan 104a of a soler flow generator 104 is rotated, solder flow in the direction spposite from the conveying direction of the substrate 12 is produced in the tank 102 and the solder flow in the same direction as the conveying direction of the substrate 12 is produced in the tank 105 by way of a communicating part 103. There is a solder flow accelerator 110 in the tank 105, and the solder flow is further accelerated by the revolution of a grooved revolving shaft 110a. The printed substrate 12 is soldered continuously by these two soldering tanks.
JP6630780A 1980-05-19 1980-05-19 Soldering device Granted JPS56163073A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6630780A JPS56163073A (en) 1980-05-19 1980-05-19 Soldering device
KR1019810001671A KR840001731B1 (en) 1980-05-19 1981-05-15 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6630780A JPS56163073A (en) 1980-05-19 1980-05-19 Soldering device

Publications (2)

Publication Number Publication Date
JPS56163073A true JPS56163073A (en) 1981-12-15
JPS5744434B2 JPS5744434B2 (en) 1982-09-21

Family

ID=13312017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6630780A Granted JPS56163073A (en) 1980-05-19 1980-05-19 Soldering device

Country Status (2)

Country Link
JP (1) JPS56163073A (en)
KR (1) KR840001731B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139993A (en) * 1981-02-23 1982-08-30 Matsushita Electric Ind Co Ltd Method and device for soldering printed board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051449A (en) * 1973-09-07 1975-05-08
SU627934A1 (en) * 1977-01-10 1987-08-25 Рижский Ордена Ленина Государственный Завод Вэф Им. В.И.Ленина Device for soldering and blanching printed boards

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051449A (en) * 1973-09-07 1975-05-08
SU627934A1 (en) * 1977-01-10 1987-08-25 Рижский Ордена Ленина Государственный Завод Вэф Им. В.И.Ленина Device for soldering and blanching printed boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139993A (en) * 1981-02-23 1982-08-30 Matsushita Electric Ind Co Ltd Method and device for soldering printed board
JPS6257428B2 (en) * 1981-02-23 1987-12-01 Matsushita Electric Ind Co Ltd

Also Published As

Publication number Publication date
KR830005952A (en) 1983-09-14
KR840001731B1 (en) 1984-10-17
JPS5744434B2 (en) 1982-09-21

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