JPS5744434B2 - - Google Patents

Info

Publication number
JPS5744434B2
JPS5744434B2 JP55066307A JP6630780A JPS5744434B2 JP S5744434 B2 JPS5744434 B2 JP S5744434B2 JP 55066307 A JP55066307 A JP 55066307A JP 6630780 A JP6630780 A JP 6630780A JP S5744434 B2 JPS5744434 B2 JP S5744434B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55066307A
Other languages
Japanese (ja)
Other versions
JPS56163073A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6630780A priority Critical patent/JPS56163073A/en
Priority to KR1019810001671A priority patent/KR840001731B1/en
Publication of JPS56163073A publication Critical patent/JPS56163073A/en
Publication of JPS5744434B2 publication Critical patent/JPS5744434B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
JP6630780A 1980-05-19 1980-05-19 Soldering device Granted JPS56163073A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6630780A JPS56163073A (en) 1980-05-19 1980-05-19 Soldering device
KR1019810001671A KR840001731B1 (en) 1980-05-19 1981-05-15 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6630780A JPS56163073A (en) 1980-05-19 1980-05-19 Soldering device

Publications (2)

Publication Number Publication Date
JPS56163073A JPS56163073A (en) 1981-12-15
JPS5744434B2 true JPS5744434B2 (en) 1982-09-21

Family

ID=13312017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6630780A Granted JPS56163073A (en) 1980-05-19 1980-05-19 Soldering device

Country Status (2)

Country Link
JP (1) JPS56163073A (en)
KR (1) KR840001731B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139993A (en) * 1981-02-23 1982-08-30 Matsushita Electric Ind Co Ltd Method and device for soldering printed board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051449A (en) * 1973-09-07 1975-05-08
SU627934A1 (en) * 1977-01-10 1987-08-25 Рижский Ордена Ленина Государственный Завод Вэф Им. В.И.Ленина Device for soldering and blanching printed boards

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051449A (en) * 1973-09-07 1975-05-08
SU627934A1 (en) * 1977-01-10 1987-08-25 Рижский Ордена Ленина Государственный Завод Вэф Им. В.И.Ленина Device for soldering and blanching printed boards

Also Published As

Publication number Publication date
KR830005952A (en) 1983-09-14
KR840001731B1 (en) 1984-10-17
JPS56163073A (en) 1981-12-15

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