SU563240A1 - Appliance for supersonic soldering and - Google Patents

Appliance for supersonic soldering and

Info

Publication number
SU563240A1
SU563240A1 SU7402051924A SU2051924A SU563240A1 SU 563240 A1 SU563240 A1 SU 563240A1 SU 7402051924 A SU7402051924 A SU 7402051924A SU 2051924 A SU2051924 A SU 2051924A SU 563240 A1 SU563240 A1 SU 563240A1
Authority
SU
USSR - Soviet Union
Prior art keywords
appliance
soldering
supersonic
supersonic soldering
products
Prior art date
Application number
SU7402051924A
Other languages
Russian (ru)
Inventor
Юрий Павлович Тризна
Леонид Иванович Панов
Анатолий Тимофеевич Панашев
Виталий Александрович Ковальчук
Владилен Михайлович Опалев
Original Assignee
Предприятие П/Я Г-4645
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я Г-4645 filed Critical Предприятие П/Я Г-4645
Priority to SU7402051924A priority Critical patent/SU563240A1/en
Application granted granted Critical
Publication of SU563240A1 publication Critical patent/SU563240A1/en

Links

Landscapes

  • Molten Solder (AREA)

Description

камеру 1. Под действием ультразвуковых колебаний на волне припо  происходит удаление окисной пленки с поверхности изделий и их пайка (лужение). Затем готовое изделие проходит через выходной патрубок ванны 7 под перегородкой на выгрузку.chamber 1. Under the action of ultrasonic vibrations on the wave, the oxide film is removed from the surface of the products and soldered (tinned). Then the finished product passes through the outlet of the bath 7 under the partition for unloading.

Предложенное устройство дл  ультразвуковой пайки и лужени  волной припо  изделий , преимущественно плат печатного монтажа , в защитной среде позвол ет производить безфлюсовую ультразвуковую пайку (лужение ) изделий, что улучщает качество па ных соединений и их надежность.The proposed device for ultrasonic soldering and wave soldering of products, mainly printed circuit boards, in a protective environment allows flux-free ultrasonic soldering (tinning) of products, which improves the quality of soldered joints and their reliability.

Claims (2)

1. Авторское свидетельство СССР №239313, кл. В 23К 3/06, 1971.1. USSR author's certificate No. 239313, cl. 23K 3/06, 1971. 2. Патент ФРГ № 152415, кл. В 23К 1/08, 1964.2. Patent of Germany No. 152415, cl. In 23K 1/08, 1964. 5five
SU7402051924A 1974-08-09 1974-08-09 Appliance for supersonic soldering and SU563240A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU7402051924A SU563240A1 (en) 1974-08-09 1974-08-09 Appliance for supersonic soldering and

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU7402051924A SU563240A1 (en) 1974-08-09 1974-08-09 Appliance for supersonic soldering and

Publications (1)

Publication Number Publication Date
SU563240A1 true SU563240A1 (en) 1977-06-30

Family

ID=20593553

Family Applications (1)

Application Number Title Priority Date Filing Date
SU7402051924A SU563240A1 (en) 1974-08-09 1974-08-09 Appliance for supersonic soldering and

Country Status (1)

Country Link
SU (1) SU563240A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4821947A (en) * 1988-02-08 1989-04-18 Union Carbide Corporation Fluxless application of a metal-comprising coating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4821947A (en) * 1988-02-08 1989-04-18 Union Carbide Corporation Fluxless application of a metal-comprising coating

Similar Documents

Publication Publication Date Title
FR2241180B1 (en)
JPS51124915A (en) Ultrasonic wave transmit-receive wave device
SU563240A1 (en) Appliance for supersonic soldering and
JPS5226247A (en) Apparatus for generating wave on liquid surface
JPS5230162A (en) Semiconductor device
AT354778B (en) FOCUSED SOUND HEAD WITH SWINGARM AND SOUND LENS FOR EXAMS WITH ULTRASONIC AFTER THE IMPULSE ECHO PROCESS
SU670399A1 (en) Microcircuit board soldering apparatus
SU606722A1 (en) Board glueing-up arrangement
JPS525975A (en) Vibration device to supersonic washing
JPS52113162A (en) Preparation of semiconductor device
SU464401A1 (en) The method of processing the edges of sheets for welding
SU498134A2 (en) Solder for soldering products
JPS5671576A (en) Jet type soldering device
JPS5545501A (en) Soldering tool
JPS51123086A (en) Semicanductor device and its production process
SU597739A1 (en) Solution for selective etching of copper
Winkler Assisting the Soft Soldering Process by Ultrasonics
GB1498605A (en) Soldering process
SU512875A1 (en) The method of soldering contact nodes
JPS5643722A (en) Photoetching
JPS5568174A (en) Ultrasonic soldering method of ceramics element
JPS5228443A (en) Ultrasonic soldering device
SU683867A1 (en) Method of blanching contact areas of printed circuit boards
MADDEN et al. NICKEL-BORON ELECTROLESS COATINGS, PAPER FROM PROCEEDINGS OF THE 1973 SYMPOSIUM ON ELECTRODEPOSITED METALS FOR SELECTED APPLICATIONS
CA887889A (en) Process and apparatus for finishing solder joints on a circuit board