JPS56161650A - Semiconductor element for appraisement - Google Patents

Semiconductor element for appraisement

Info

Publication number
JPS56161650A
JPS56161650A JP6498280A JP6498280A JPS56161650A JP S56161650 A JPS56161650 A JP S56161650A JP 6498280 A JP6498280 A JP 6498280A JP 6498280 A JP6498280 A JP 6498280A JP S56161650 A JPS56161650 A JP S56161650A
Authority
JP
Japan
Prior art keywords
voltage
insulating film
elements
terminal
turned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6498280A
Other languages
Japanese (ja)
Other versions
JPS6159657B2 (en
Inventor
Heihachi Matsumoto
Kokichi Sawada
Chukichi Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6498280A priority Critical patent/JPS56161650A/en
Publication of JPS56161650A publication Critical patent/JPS56161650A/en
Publication of JPS6159657B2 publication Critical patent/JPS6159657B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To enable the breakdown voltage of an insulating film to be appraised short period in a waferred state by a method wherein each insulating film element is provided with a terminal for the appraisement and also a voltage is simultaneously applied to the individual element through a switch element 4. CONSTITUTION:The numbers of the insulating film elements 2 mounted on the wafer 1 are provided with the checking terminals 3 and the switch elements 4 respectively to be connected therewith, and the voltage is applied between an earth terminal 7 and a voltage applied terminal 5. The respective switch elements feed signals to a terminal 6 to be turned ON or OFF in common. In the beginning, the all insulating film elements are leak-checked by means of the terminals 3 leaving the switch elements OFF. Then, the switch elements are turned OFF to make the leak check again after being turned ON to apply the voltage to the all elements for the prescribed period of time. By repeating the same operations, the relationship between the modulus of rapture and trouble of the insulating film and the period of the voltage application can be appraised in a short period of time in the waferred state.
JP6498280A 1980-05-15 1980-05-15 Semiconductor element for appraisement Granted JPS56161650A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6498280A JPS56161650A (en) 1980-05-15 1980-05-15 Semiconductor element for appraisement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6498280A JPS56161650A (en) 1980-05-15 1980-05-15 Semiconductor element for appraisement

Publications (2)

Publication Number Publication Date
JPS56161650A true JPS56161650A (en) 1981-12-12
JPS6159657B2 JPS6159657B2 (en) 1986-12-17

Family

ID=13273764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6498280A Granted JPS56161650A (en) 1980-05-15 1980-05-15 Semiconductor element for appraisement

Country Status (1)

Country Link
JP (1) JPS56161650A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63312648A (en) * 1987-06-15 1988-12-21 Nippon Telegr & Teleph Corp <Ntt> Manufacture of semiconductor integrated circuit chip
JPH0251246A (en) * 1988-08-12 1990-02-21 Oki Electric Ind Co Ltd Method of detecting defect of semiconductor integrated circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051267A (en) * 1973-09-07 1975-05-08
JPS5332679A (en) * 1976-09-08 1978-03-28 Hitachi Ltd Easy to inspect lsi mounting package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051267A (en) * 1973-09-07 1975-05-08
JPS5332679A (en) * 1976-09-08 1978-03-28 Hitachi Ltd Easy to inspect lsi mounting package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63312648A (en) * 1987-06-15 1988-12-21 Nippon Telegr & Teleph Corp <Ntt> Manufacture of semiconductor integrated circuit chip
JPH0251246A (en) * 1988-08-12 1990-02-21 Oki Electric Ind Co Ltd Method of detecting defect of semiconductor integrated circuit

Also Published As

Publication number Publication date
JPS6159657B2 (en) 1986-12-17

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