JPS5720460A - Wiring device - Google Patents

Wiring device

Info

Publication number
JPS5720460A
JPS5720460A JP9483780A JP9483780A JPS5720460A JP S5720460 A JPS5720460 A JP S5720460A JP 9483780 A JP9483780 A JP 9483780A JP 9483780 A JP9483780 A JP 9483780A JP S5720460 A JPS5720460 A JP S5720460A
Authority
JP
Japan
Prior art keywords
holes
terminal
conductive
constitution
response
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9483780A
Other languages
Japanese (ja)
Inventor
Osamu Sugano
Yasuhiko Takamatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP9483780A priority Critical patent/JPS5720460A/en
Publication of JPS5720460A publication Critical patent/JPS5720460A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

Abstract

PURPOSE:To simplify a manufacturing process of the titled device by a method wherein a terminal for connecting to the outside and a conductive passage communicated with the terminal are carried on a flexible insulating film, and an IC is loaded on a film in response to an external device. CONSTITUTION:Holes 26 are bored to the polyimide film 21 at regular intervals in the width direction, and the conductive passages 23, 24 are each formed in response to the holes 26. The conductive passage sections projecting into the holes 26 are joined with the ICs 22. The conductive passages 24 are used form connecting to the external apparatus and terminal sections 241 are mounted. When using the wiring device according to this constitution, the manufacturing process of the titled device can be simplified.
JP9483780A 1980-07-11 1980-07-11 Wiring device Pending JPS5720460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9483780A JPS5720460A (en) 1980-07-11 1980-07-11 Wiring device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9483780A JPS5720460A (en) 1980-07-11 1980-07-11 Wiring device

Publications (1)

Publication Number Publication Date
JPS5720460A true JPS5720460A (en) 1982-02-02

Family

ID=14121150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9483780A Pending JPS5720460A (en) 1980-07-11 1980-07-11 Wiring device

Country Status (1)

Country Link
JP (1) JPS5720460A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278346U (en) * 1988-12-01 1990-06-15

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278346U (en) * 1988-12-01 1990-06-15

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