JPS56138945A - Coating method of axial lead with solder - Google Patents

Coating method of axial lead with solder

Info

Publication number
JPS56138945A
JPS56138945A JP4270980A JP4270980A JPS56138945A JP S56138945 A JPS56138945 A JP S56138945A JP 4270980 A JP4270980 A JP 4270980A JP 4270980 A JP4270980 A JP 4270980A JP S56138945 A JPS56138945 A JP S56138945A
Authority
JP
Japan
Prior art keywords
solder
oven
lead wire
piece
jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4270980A
Other languages
English (en)
Inventor
Kenzo Senba
Hitoshi Mori
Yoshiaki Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP4270980A priority Critical patent/JPS56138945A/ja
Publication of JPS56138945A publication Critical patent/JPS56138945A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP4270980A 1980-03-31 1980-03-31 Coating method of axial lead with solder Pending JPS56138945A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4270980A JPS56138945A (en) 1980-03-31 1980-03-31 Coating method of axial lead with solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4270980A JPS56138945A (en) 1980-03-31 1980-03-31 Coating method of axial lead with solder

Publications (1)

Publication Number Publication Date
JPS56138945A true JPS56138945A (en) 1981-10-29

Family

ID=12643591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4270980A Pending JPS56138945A (en) 1980-03-31 1980-03-31 Coating method of axial lead with solder

Country Status (1)

Country Link
JP (1) JPS56138945A (ja)

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