JPS55165276A - Solder plating device of printed wiring substrate - Google Patents

Solder plating device of printed wiring substrate

Info

Publication number
JPS55165276A
JPS55165276A JP7340779A JP7340779A JPS55165276A JP S55165276 A JPS55165276 A JP S55165276A JP 7340779 A JP7340779 A JP 7340779A JP 7340779 A JP7340779 A JP 7340779A JP S55165276 A JPS55165276 A JP S55165276A
Authority
JP
Japan
Prior art keywords
solder
printed wiring
heater
substrate
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7340779A
Other languages
Japanese (ja)
Other versions
JPS5926387B2 (en
Inventor
Katsuki Takemura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP7340779A priority Critical patent/JPS5926387B2/en
Publication of JPS55165276A publication Critical patent/JPS55165276A/en
Publication of JPS5926387B2 publication Critical patent/JPS5926387B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Molten Solder (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: To make possible solder plating of low cost by disposing a flux coater, heater, soldering device, roll device and heater subsequently along the conveying direction of printed wiring substrates.
CONSTITUTION: This is the device which is capable of working an even solder plating layer at a high speed on the copper foil surfaces of printed wiring substrates. A laminated printed wiring substrate 2 is fed in the arrow direction by a conveyor 1. In a flux coater 3, flux solution 3a is bubbled and the flux is coated on the substrate which is then dried by a heater 4. Thence, the substrate is dipped in the solder 5b flow melted by a heater 5a to let the solder deposit thereon. The substrate is then rolled by a roll device 6 to even the thickness of the solder. A heating control part 6a which controls atmosphere temperature to above the solder melting point is provided to this device. Finally, in order to remove the flash produced at the rolling, hot wind is sent by a blower 7 to melt the flash and melt the same into the solder plating layer.
COPYRIGHT: (C)1980,JPO&Japio
JP7340779A 1979-06-11 1979-06-11 Solder plating processing equipment for printed wiring boards Expired JPS5926387B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7340779A JPS5926387B2 (en) 1979-06-11 1979-06-11 Solder plating processing equipment for printed wiring boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7340779A JPS5926387B2 (en) 1979-06-11 1979-06-11 Solder plating processing equipment for printed wiring boards

Publications (2)

Publication Number Publication Date
JPS55165276A true JPS55165276A (en) 1980-12-23
JPS5926387B2 JPS5926387B2 (en) 1984-06-27

Family

ID=13517301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7340779A Expired JPS5926387B2 (en) 1979-06-11 1979-06-11 Solder plating processing equipment for printed wiring boards

Country Status (1)

Country Link
JP (1) JPS5926387B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980991A (en) * 1982-10-30 1984-05-10 日本メクトロン株式会社 Method of pretreating solder in circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5980991A (en) * 1982-10-30 1984-05-10 日本メクトロン株式会社 Method of pretreating solder in circuit board

Also Published As

Publication number Publication date
JPS5926387B2 (en) 1984-06-27

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