JPS55165276A - Solder plating device of printed wiring substrate - Google Patents
Solder plating device of printed wiring substrateInfo
- Publication number
- JPS55165276A JPS55165276A JP7340779A JP7340779A JPS55165276A JP S55165276 A JPS55165276 A JP S55165276A JP 7340779 A JP7340779 A JP 7340779A JP 7340779 A JP7340779 A JP 7340779A JP S55165276 A JPS55165276 A JP S55165276A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- printed wiring
- heater
- substrate
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Molten Solder (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE: To make possible solder plating of low cost by disposing a flux coater, heater, soldering device, roll device and heater subsequently along the conveying direction of printed wiring substrates.
CONSTITUTION: This is the device which is capable of working an even solder plating layer at a high speed on the copper foil surfaces of printed wiring substrates. A laminated printed wiring substrate 2 is fed in the arrow direction by a conveyor 1. In a flux coater 3, flux solution 3a is bubbled and the flux is coated on the substrate which is then dried by a heater 4. Thence, the substrate is dipped in the solder 5b flow melted by a heater 5a to let the solder deposit thereon. The substrate is then rolled by a roll device 6 to even the thickness of the solder. A heating control part 6a which controls atmosphere temperature to above the solder melting point is provided to this device. Finally, in order to remove the flash produced at the rolling, hot wind is sent by a blower 7 to melt the flash and melt the same into the solder plating layer.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7340779A JPS5926387B2 (en) | 1979-06-11 | 1979-06-11 | Solder plating processing equipment for printed wiring boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7340779A JPS5926387B2 (en) | 1979-06-11 | 1979-06-11 | Solder plating processing equipment for printed wiring boards |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55165276A true JPS55165276A (en) | 1980-12-23 |
JPS5926387B2 JPS5926387B2 (en) | 1984-06-27 |
Family
ID=13517301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7340779A Expired JPS5926387B2 (en) | 1979-06-11 | 1979-06-11 | Solder plating processing equipment for printed wiring boards |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5926387B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5980991A (en) * | 1982-10-30 | 1984-05-10 | 日本メクトロン株式会社 | Method of pretreating solder in circuit board |
-
1979
- 1979-06-11 JP JP7340779A patent/JPS5926387B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5980991A (en) * | 1982-10-30 | 1984-05-10 | 日本メクトロン株式会社 | Method of pretreating solder in circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS5926387B2 (en) | 1984-06-27 |
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