JPS5751255A - Method for fluidized dip soldering and plating - Google Patents

Method for fluidized dip soldering and plating

Info

Publication number
JPS5751255A
JPS5751255A JP12433980A JP12433980A JPS5751255A JP S5751255 A JPS5751255 A JP S5751255A JP 12433980 A JP12433980 A JP 12433980A JP 12433980 A JP12433980 A JP 12433980A JP S5751255 A JPS5751255 A JP S5751255A
Authority
JP
Japan
Prior art keywords
solder
fluidized
plated
dip soldering
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12433980A
Other languages
Japanese (ja)
Inventor
Fumio Kobayashi
Kazutoshi Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12433980A priority Critical patent/JPS5751255A/en
Publication of JPS5751255A publication Critical patent/JPS5751255A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To perform fluidized dip soldering forming films of uniform thickness and pemitting controlling of film thickness to a certain extent by dipping a preheated object to be soldered and plated into the powder or granular solder in a vessel fluidized by the air blown through the perforated pipe from the lower part of a dipping vessel. CONSTITUTION:Air is blown through a perforated plate 3 from below to the powder and granular solder 2 put into a fluidized dipping vessel 1 to fluidize the solder 2. In this state, a preheated object 5 to be soldered and plated is dipped into the solder 2, to stick the solder 2 by melting on the object 5, whereby the fluidized dip soldering and plating are accomplished. At the point of the time when the object 5 is plated to prescribed film thickness, the melting of the solder 2 is stopped. The plated object is fed to a heating furnace and is subjected to prescribed processes in order to have higher gloss on the surface.
JP12433980A 1980-09-08 1980-09-08 Method for fluidized dip soldering and plating Pending JPS5751255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12433980A JPS5751255A (en) 1980-09-08 1980-09-08 Method for fluidized dip soldering and plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12433980A JPS5751255A (en) 1980-09-08 1980-09-08 Method for fluidized dip soldering and plating

Publications (1)

Publication Number Publication Date
JPS5751255A true JPS5751255A (en) 1982-03-26

Family

ID=14882898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12433980A Pending JPS5751255A (en) 1980-09-08 1980-09-08 Method for fluidized dip soldering and plating

Country Status (1)

Country Link
JP (1) JPS5751255A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2560219A1 (en) * 1984-02-27 1985-08-30 Stein Heurtey Process and device for improving the physicochemical properties of hot-coated metal sheets
EP0595343A2 (en) * 1992-10-30 1994-05-04 Showa Denko Kabushiki Kaisha Method of forming solder film

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2560219A1 (en) * 1984-02-27 1985-08-30 Stein Heurtey Process and device for improving the physicochemical properties of hot-coated metal sheets
EP0595343A2 (en) * 1992-10-30 1994-05-04 Showa Denko Kabushiki Kaisha Method of forming solder film
EP0595343A3 (en) * 1992-10-30 1994-06-08 Showa Denko Kk Method of forming solder film

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