JPS5980991A - Method of pretreating solder in circuit board - Google Patents
Method of pretreating solder in circuit boardInfo
- Publication number
- JPS5980991A JPS5980991A JP19159182A JP19159182A JPS5980991A JP S5980991 A JPS5980991 A JP S5980991A JP 19159182 A JP19159182 A JP 19159182A JP 19159182 A JP19159182 A JP 19159182A JP S5980991 A JPS5980991 A JP S5980991A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- solder
- hot air
- heat
- pretreating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は硬質回路基板又は可撓性し一路基板等の回路基
板の所定部分に付せもれた半田を部品の半田付は作業前
に予め融解しておく、半田の予備処理方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention is a method of removing solder that has been applied to a predetermined portion of a circuit board such as a hard circuit board or a flexible one-way board by melting the solder in advance before soldering the components. The present invention relates to a preliminary treatment method.
従来、かかる目的のために、回路基板を載せた耐熱ベル
トをホットプレート上を移動させることにより半田を融
解（ヒユージング）する方法（以下、「ホットプレート
法」という）、遠赤外味、中赤外線若しくは近赤外線等
の熱線を半田面に照射する方法（以下、「熱線照射法」
という）、又は、前記の熱線に他の熱源を組合せ且つこ
れらの熱源からの輻射熱゛を回路基板の上面及び／又は
下面に及ばず方法（以下、「複数熱源組合せ法」という
）が使用されているが、いずれも何らかの無視し得ない
不具合があった。即ち、前記ホットプレート法において
は、回路基板の全面が均一に耐熱ベルトに接触している
必要があるが、特に可撓性回路基板についてはかかる状
態を維持するのが困難であり、また、回路基板の面積が
例えば２ＣｌＯｍ’又は６００−の如く大きな場合にＬ
ホットプレート自体の温り、しかも、これを解決しよう
とするとホットプレート自体が高価なものとなり、更に
、耐熱ベルトは頻繁に交換しなければならないため手間
及び費用がかかるという問題があった。一方、前記の熱
線照射法又は複数熱源組合せ法の如く熱線を利用する方
法においては、輻射熱を利用するため、例えば回路基板
の上面側よシ照射する場合、半田部分及びベース材面部
分に同一エネルギーが照射され、半田面はこの光エネル
ギーが半田融解熱として吸収消費されるが、ベース材面
は熱としてベース材に吸収、蓄積されることとなシ、そ
の結果、半田面とベース材面との間には約４０’〜５０
℃、ベース材の厚さが部分的に異なる場合には８０〜１
００６Ｃの温度差が生じてベース材を変質させたシ、半
田が融解しない部分を生じたシする等の不都合があシ、
また、更に、ベース材がカールした場合には熱源に近い
部分と遠い部分との間に温度差、例えば、熱源からの距
離が５ｍ異なったとき約５０”Ｃの温度差が生じること
もある。Conventionally, for this purpose, there has been a method of melting solder by moving a heat-resistant belt carrying a circuit board over a hot plate (hereinafter referred to as the "hot plate method"), far-infrared, mid-infrared, etc. Alternatively, a method of irradiating the solder surface with heat rays such as near-infrared rays (hereinafter referred to as "heat ray irradiation method")
(hereinafter referred to as "multiple heat source combination method") is used. However, all of them had some kind of problem that could not be ignored. That is, in the hot plate method, the entire surface of the circuit board must be in uniform contact with the heat-resistant belt, but it is difficult to maintain such a state, especially for flexible circuit boards, and the circuit board When the area of the substrate is large, for example 2ClOm' or 600-
There was a problem with the heat of the hot plate itself, and if an attempt was made to solve this problem, the hot plate itself would become expensive, and furthermore, the heat-resistant belt would have to be replaced frequently, which would be laborious and expensive. On the other hand, in methods that utilize heat rays, such as the above-mentioned heat ray irradiation method or multiple heat source combination method, radiant heat is used. is irradiated, and the solder surface absorbs and consumes this light energy as solder melting heat, but the base material surface absorbs and accumulates heat in the base material, and as a result, the solder surface and base material surface Approximately 40' to 50
℃, 80 to 1 if the thickness of the base material is partially different
There are disadvantages such as a temperature difference of 006C that changes the quality of the base material, and parts where the solder does not melt.
Furthermore, if the base material curls, a temperature difference may occur between a portion close to the heat source and a portion far from the heat source, for example, a temperature difference of about 50''C when the distance from the heat source differs by 5 meters.
本発明は上記の諸問題に鑑みて為されたもので、回路基
板中子め半田を融解させておく必要のある部分にのみ熱
風を吹付けることにより、所要部分のみが効率的に加熱
され融解されるような、回路基板における半田の予備処
理方法を提供しようとするものである。The present invention was made in view of the above-mentioned problems, and by blowing hot air only on the parts of the circuit board core that need to be melted, only the necessary parts are efficiently heated and melted. The present invention aims to provide a method for pre-processing solder on a circuit board.
本発明の実施例を添付図面を参照しつつ説明すると、ロ
ーラー１．１を介して所定の方向に移動させられる搬送
ベルト２上に、半田面を外方に向けた回路基板３，６・
・・・・・が載置されておシ、該回路基板３．３・・・
・・・に対し適宜の距離をおいて、熱風吹出ユニット４
゜４・・・・・・が機枠５に支持されて配設されている
。熱風吹出ヱニット４．４・・・・・・は、回路基板３
，６・・・・・・の所要部分即ち融解すべき半田部分に
向けられた熱風吹出口４Ａ 、 ４Ａ・・・・・・を具
えている。仁の熱風吹出口４Ａ 。An embodiment of the present invention will be described with reference to the accompanying drawings. Circuit boards 3, 6 with their solder surfaces facing outward are placed on a conveyor belt 2 that is moved in a predetermined direction via rollers 1.1.
... is placed on the circuit board 3.3...
The hot air blowing unit 4 is placed at an appropriate distance from...
゜4... are disposed and supported by the machine frame 5. Hot air blowing unit 4.4... is the circuit board 3
, 6, . . . are provided with hot air outlets 4A, 4A, . Jin's hot air outlet 4A.
４Ａ・・・・・・ は回路基板３，３・・・・・・の材
質、半田融解のための設定時間等の条件に応じた、即ち
、目的に応じた温度及び風量が得られるように構成され
た例えば１〜５飼程度の巾のスリットとして形成される
。スリットは、処理すべき回路基板の種類、寸法に応じ
てその巾、位置を適宜変化させ得る機構を併有させれば
、使用上よシ便利なものとなる。上記の熱風吹出口４Ａ
、４Ａ・・・・・・ よ多回路基板６゜６・・・・・
・に吹付ける熱風を構成する気体としては通常は空気、
特殊外場合には不活性ガスが使用されるが、これらに限
定されるものではなく、処理しようとする回路基板３，
６・・・・・・の種類、材質、寸法等を勘案して最適の
ものを選定、使用すればよい。4A... is set according to the conditions such as the material of the circuit board 3, 3..., the set time for melting the solder, etc., that is, the temperature and air volume are adjusted according to the purpose. For example, it is formed as a slit with a width of about 1 to 5 animals. The slit will be more convenient to use if it is equipped with a mechanism that allows the width and position of the slit to be changed appropriately depending on the type and size of the circuit board to be processed. Above hot air outlet 4A
, 4A... Multi-circuit board 6゜6...
・The gas that makes up the hot air that is blown on is usually air,
In special cases, inert gas is used, but it is not limited to these, and the circuit board 3 to be processed,
6. The most suitable one should be selected and used by considering the type, material, dimensions, etc.
かかる装置によシ、回路基板３．６・・・・・・の所定
の半田部分が所定の位置に移送されてきた時に、熱風吹
出口４Ａ 、４Ａ・・・・・・ より熱風を吹出させて
、当核半田部分にのみ熱風を吹付けてこれを加熱すれば
、該半田部分は融解されて、次の部品取付作業を行なう
のに適した状態となる。According to this device, when a predetermined solder portion of the circuit board 3.6... is transferred to a predetermined position, hot air is blown out from the hot air outlet 4A, 4A... Then, by blowing hot air only onto the core solder portion and heating it, the solder portion will be melted and will be in a state suitable for the next component attachment work.
なお、本発明方法の実施の際に、図中鎖線で示す如く熱
線ヒーター６．６・・・・・・例えば赤外線ヒーターを
回路基板６，３・・・・・・より適宜の距離の位置に配
設し、その温度を適切に設定することによ多回路基板６
．３・・・・・・の半田部分の酸化を防止するようにす
れば更に良い。In addition, when carrying out the method of the present invention, as shown by the chain line in the figure, a hot wire heater 6.6...for example, an infrared heater is placed at an appropriate distance from the circuit boards 6, 3... By arranging the multi-circuit board 6 and setting its temperature appropriately,
．． It would be even better if oxidation of the solder portions in 3..... could be prevented.
以上述べたところから明らかなように、本発明は、回路
基板中子め半田を融解させておく必要、のある部分のみ
を熱風によって加熱するようにしたので、回路基板に対
する加熱温度の分布が不均一となシ且つ回路基板の大き
さが費用面から制約されるホットプレート及び加熱によ
る損耗ないしそのだめの交換を伴なう前記耐熱ベルトを
採用することが不要となシ即ちホットプレート法の不１
５１Ｓ合は何ら生ぜず、また、上記熱風による所定半田
部分のみの加熱によυベース材の変質を招かず従って前
記した熱線輻射法及び複数熱源組合せ法のもたらす不都
合も全く生じない、等優れた効果を奏するものである。As is clear from the above description, the present invention uses hot air to heat only the portions where the solder on the circuit board core needs to be melted, so that the distribution of heating temperature on the circuit board is uneven. It is unnecessary to use a hot plate, which has a uniform surface and the size of the circuit board is limited by cost, and the heat-resistant belt, which is subject to wear and tear due to heating and the replacement of the belt. 1
51S does not occur at all, and the heating of only the predetermined solder portion by the hot air does not cause deterioration of the υ base material, and therefore, the disadvantages caused by the hot ray radiation method and the multiple heat source combination method described above do not occur at all. It is effective.
図面は本発明に係る回路基板における半田の予備処理方
法の実施に使用する装置の一例を概念的に示す図である
。
６・・・・・・回路基板
４・・・・・・熱風吹出ユニット
４Ａ・・・・・・熱風吹出口The drawing is a diagram conceptually showing an example of an apparatus used to carry out the method for pre-processing solder on a circuit board according to the present invention. 6...Circuit board 4...Hot air blowing unit 4A...Hot air blowing outlet
Claims (1)
よシ該半田部分を部品取付前に予め予備半田として融解
させておくことを特徴とする、回路基板における半田の
予備処理方法。1. A method for pre-processing solder on a circuit board, the method comprising blowing hot air only onto predetermined solder portions of the circuit board to melt the solder portions as preliminary solder before mounting components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19159182A JPS5980991A (en) | 1982-10-30 | 1982-10-30 | Method of pretreating solder in circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19159182A JPS5980991A (en) | 1982-10-30 | 1982-10-30 | Method of pretreating solder in circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5980991A true JPS5980991A (en) | 1984-05-10 |
Family
ID=16277182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19159182A Pending JPS5980991A (en) | 1982-10-30 | 1982-10-30 | Method of pretreating solder in circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5980991A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51101863A (en) * | 1975-03-06 | 1976-09-08 | Tokyo Shibaura Electric Co | DENSHIKAIROSO CHISEIZOHO |
| JPS55165276A (en) * | 1979-06-11 | 1980-12-23 | Matsushita Electric Ind Co Ltd | Solder plating device of printed wiring substrate |
-
1982
- 1982-10-30 JP JP19159182A patent/JPS5980991A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51101863A (en) * | 1975-03-06 | 1976-09-08 | Tokyo Shibaura Electric Co | DENSHIKAIROSO CHISEIZOHO |
| JPS55165276A (en) * | 1979-06-11 | 1980-12-23 | Matsushita Electric Ind Co Ltd | Solder plating device of printed wiring substrate |
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