JPS56131934A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS56131934A JPS56131934A JP3506680A JP3506680A JPS56131934A JP S56131934 A JPS56131934 A JP S56131934A JP 3506680 A JP3506680 A JP 3506680A JP 3506680 A JP3506680 A JP 3506680A JP S56131934 A JPS56131934 A JP S56131934A
- Authority
- JP
- Japan
- Prior art keywords
- ash3
- substrate
- improved
- laser
- state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3506680A JPS56131934A (en) | 1980-03-19 | 1980-03-19 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3506680A JPS56131934A (en) | 1980-03-19 | 1980-03-19 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56131934A true JPS56131934A (en) | 1981-10-15 |
JPS637022B2 JPS637022B2 (enrdf_load_stackoverflow) | 1988-02-15 |
Family
ID=12431639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3506680A Granted JPS56131934A (en) | 1980-03-19 | 1980-03-19 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56131934A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5873112A (ja) * | 1981-10-28 | 1983-05-02 | Nippon Hoso Kyokai <Nhk> | レ−ザアニ−ル方法 |
JPH05129203A (ja) * | 1991-11-07 | 1993-05-25 | Japan Steel Works Ltd:The | エピタキシヤル薄膜の形成方法 |
WO2007097103A1 (ja) * | 2006-02-23 | 2007-08-30 | Ihi Corporation | 化合物半導体の活性化方法及び装置 |
JP2008300617A (ja) * | 2007-05-31 | 2008-12-11 | Ihi Corp | レーザアニール方法及びレーザアニール装置 |
WO2016093287A1 (ja) * | 2014-12-10 | 2016-06-16 | 東京エレクトロン株式会社 | 微細構造形成方法、半導体デバイスの製造方法、及びcmosの形成方法 |
-
1980
- 1980-03-19 JP JP3506680A patent/JPS56131934A/ja active Granted
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5873112A (ja) * | 1981-10-28 | 1983-05-02 | Nippon Hoso Kyokai <Nhk> | レ−ザアニ−ル方法 |
JPH05129203A (ja) * | 1991-11-07 | 1993-05-25 | Japan Steel Works Ltd:The | エピタキシヤル薄膜の形成方法 |
WO2007097103A1 (ja) * | 2006-02-23 | 2007-08-30 | Ihi Corporation | 化合物半導体の活性化方法及び装置 |
JP2007227629A (ja) * | 2006-02-23 | 2007-09-06 | Ishikawajima Harima Heavy Ind Co Ltd | 化合物半導体の活性化方法及び装置 |
US7888250B2 (en) | 2006-02-23 | 2011-02-15 | Ihi Corporation | Method and apparatus for activating compound semiconductor |
KR101102635B1 (ko) * | 2006-02-23 | 2012-01-04 | 가부시키가이샤 아이에이치아이 | 화합물 반도체의 활성화 방법 및 장치 |
JP2008300617A (ja) * | 2007-05-31 | 2008-12-11 | Ihi Corp | レーザアニール方法及びレーザアニール装置 |
WO2016093287A1 (ja) * | 2014-12-10 | 2016-06-16 | 東京エレクトロン株式会社 | 微細構造形成方法、半導体デバイスの製造方法、及びcmosの形成方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS637022B2 (enrdf_load_stackoverflow) | 1988-02-15 |
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