JPS56125863A - Semiconductor device with cooling body - Google Patents

Semiconductor device with cooling body

Info

Publication number
JPS56125863A
JPS56125863A JP2874280A JP2874280A JPS56125863A JP S56125863 A JPS56125863 A JP S56125863A JP 2874280 A JP2874280 A JP 2874280A JP 2874280 A JP2874280 A JP 2874280A JP S56125863 A JPS56125863 A JP S56125863A
Authority
JP
Japan
Prior art keywords
lead plate
gate
cooling
cooling body
cooling segment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2874280A
Other languages
Japanese (ja)
Inventor
Hideaki Onaka
Makoto Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2874280A priority Critical patent/JPS56125863A/en
Publication of JPS56125863A publication Critical patent/JPS56125863A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Thyristors (AREA)

Abstract

PURPOSE:To eliminate an induction and discrimination and improve the quality and reliability by a method wherein a gate triggering lead plate having the almost same shape as a cooling segment is provided. CONSTITUTION:The gate triggering lead plate 11 provided with a contact piece 11a contacted with a contact terminal 4a of a gate pipe 4 is in the almost same shape as the cooling segment 7a, supported by an insulator 10 (e.g. beryllia) and provided in parallel to the cooling segment 7a at a prescribed interval. In addition, the upper cooling electrode 6a, the upper cooling segment 7a and the gate triggering lead plate 11 constitute the cooling body 12 with the lead plate. By fitting the lower cooling body 8b below and the cooling body 12 with the lead plate over the semiconductor device including a semiconductor element 1, the contact element 11a of the gate triggering lead plate 11 is contacted with the contact terminal 4a of the gate pipe 4 and a trigger circuit is formed. Whereby the device is improved in the quality and reliability and assembled with ease.
JP2874280A 1980-03-06 1980-03-06 Semiconductor device with cooling body Pending JPS56125863A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2874280A JPS56125863A (en) 1980-03-06 1980-03-06 Semiconductor device with cooling body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2874280A JPS56125863A (en) 1980-03-06 1980-03-06 Semiconductor device with cooling body

Publications (1)

Publication Number Publication Date
JPS56125863A true JPS56125863A (en) 1981-10-02

Family

ID=12256867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2874280A Pending JPS56125863A (en) 1980-03-06 1980-03-06 Semiconductor device with cooling body

Country Status (1)

Country Link
JP (1) JPS56125863A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6445013B1 (en) 2000-04-13 2002-09-03 Mitsubishi Denki Kabushiki Kaisha Gate commutated turn-off semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6445013B1 (en) 2000-04-13 2002-09-03 Mitsubishi Denki Kabushiki Kaisha Gate commutated turn-off semiconductor device

Similar Documents

Publication Publication Date Title
JPS5713777A (en) Semiconductor device and manufacture thereof
JPS56125863A (en) Semiconductor device with cooling body
JPS56130969A (en) Semiconductor device
JPS5232693A (en) Semiconductor device
JPS56146263A (en) Manufacture of semiconductor device
JPS5346290A (en) Semiconductor device
JPS56146277A (en) Semiconductor device
JPS5735370A (en) Semiconductor device
JPS5237766A (en) Semiconductor device
JPS5425678A (en) Field effect transistor of ultra high frequency and high output
JPS5496366A (en) Semiconductor device
JPS5362471A (en) Semiconductor device
JPS57114287A (en) Semiconductor device
JPS57114277A (en) Semiconductor device
JPS5732655A (en) Semiconductor integrated circuit device
JPS5270766A (en) Semiconductor device
JPS56108245A (en) Semiconductor device
JPS53124072A (en) Semiconductor device
JPS57113261A (en) Semiconductor device
JPS55143054A (en) Resin sealed semiconductor device
JPS5429580A (en) Semiconductor device
JPS5575230A (en) Semiconductor device
JPS5478085A (en) Semiconductor device
JPS53124975A (en) Semiconductor device
JPS57121239A (en) Semiconductor device