JPS56116649A - Manufacturing of semiconductor device - Google Patents
Manufacturing of semiconductor deviceInfo
- Publication number
- JPS56116649A JPS56116649A JP2025580A JP2025580A JPS56116649A JP S56116649 A JPS56116649 A JP S56116649A JP 2025580 A JP2025580 A JP 2025580A JP 2025580 A JP2025580 A JP 2025580A JP S56116649 A JPS56116649 A JP S56116649A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- resin
- container
- hardening type
- ultraviolet rays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W95/00—
-
- H10W72/884—
-
- H10W90/734—
-
- H10W90/754—
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Light Receiving Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025580A JPS56116649A (en) | 1980-02-19 | 1980-02-19 | Manufacturing of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025580A JPS56116649A (en) | 1980-02-19 | 1980-02-19 | Manufacturing of semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56116649A true JPS56116649A (en) | 1981-09-12 |
| JPS6122865B2 JPS6122865B2 (cg-RX-API-DMAC10.html) | 1986-06-03 |
Family
ID=12022082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025580A Granted JPS56116649A (en) | 1980-02-19 | 1980-02-19 | Manufacturing of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56116649A (cg-RX-API-DMAC10.html) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834681A (ja) * | 1981-08-26 | 1983-03-01 | Hitachi Ltd | 固体撮像装置 |
| JPS5857871A (ja) * | 1981-10-02 | 1983-04-06 | Hitachi Ltd | 固体撮像装置 |
| JPS5869174A (ja) * | 1981-10-21 | 1983-04-25 | Hitachi Ltd | 固体撮像装置 |
| JPS5869962U (ja) * | 1981-11-06 | 1983-05-12 | 松下電器産業株式会社 | 固体撮像用シ−ム封止半導体装置 |
| JPS58170052A (ja) * | 1982-03-31 | 1983-10-06 | Sony Corp | 固体撮像装置の製法 |
| JPS5918438U (ja) * | 1982-07-27 | 1984-02-04 | シチズン時計株式会社 | 電子時計のic封止構造 |
| JPS62273768A (ja) * | 1986-05-21 | 1987-11-27 | Toshiba Corp | 固体撮像装置 |
| JPS63168041A (ja) * | 1987-01-05 | 1988-07-12 | Hitachi Maxell Ltd | 半導体装置とその製造方法 |
| JPS6457661A (en) * | 1987-08-27 | 1989-03-03 | Toshiba Corp | Solid-state image sensing device and manufacture thereof |
| JPS6464254A (en) * | 1987-09-03 | 1989-03-10 | Toshiba Corp | Solid-state image sensor and manufacture thereof |
| US6531334B2 (en) * | 1997-07-10 | 2003-03-11 | Sony Corporation | Method for fabricating hollow package with a solid-state image device |
| JP2006005029A (ja) * | 2004-06-15 | 2006-01-05 | Fujitsu Ltd | 撮像装置及びその製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5222036B2 (ja) | 2008-06-17 | 2013-06-26 | 日東電工株式会社 | 光学部品の製法 |
-
1980
- 1980-02-19 JP JP2025580A patent/JPS56116649A/ja active Granted
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834681A (ja) * | 1981-08-26 | 1983-03-01 | Hitachi Ltd | 固体撮像装置 |
| JPS5857871A (ja) * | 1981-10-02 | 1983-04-06 | Hitachi Ltd | 固体撮像装置 |
| JPS5869174A (ja) * | 1981-10-21 | 1983-04-25 | Hitachi Ltd | 固体撮像装置 |
| JPS5869962U (ja) * | 1981-11-06 | 1983-05-12 | 松下電器産業株式会社 | 固体撮像用シ−ム封止半導体装置 |
| JPS58170052A (ja) * | 1982-03-31 | 1983-10-06 | Sony Corp | 固体撮像装置の製法 |
| JPS5918438U (ja) * | 1982-07-27 | 1984-02-04 | シチズン時計株式会社 | 電子時計のic封止構造 |
| JPS62273768A (ja) * | 1986-05-21 | 1987-11-27 | Toshiba Corp | 固体撮像装置 |
| JPS63168041A (ja) * | 1987-01-05 | 1988-07-12 | Hitachi Maxell Ltd | 半導体装置とその製造方法 |
| JPS6457661A (en) * | 1987-08-27 | 1989-03-03 | Toshiba Corp | Solid-state image sensing device and manufacture thereof |
| JPS6464254A (en) * | 1987-09-03 | 1989-03-10 | Toshiba Corp | Solid-state image sensor and manufacture thereof |
| US6531334B2 (en) * | 1997-07-10 | 2003-03-11 | Sony Corporation | Method for fabricating hollow package with a solid-state image device |
| JP2006005029A (ja) * | 2004-06-15 | 2006-01-05 | Fujitsu Ltd | 撮像装置及びその製造方法 |
| US8411197B2 (en) | 2004-06-15 | 2013-04-02 | Fujitsu Semiconductor Limited | Image pickup device and production method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6122865B2 (cg-RX-API-DMAC10.html) | 1986-06-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS56116649A (en) | Manufacturing of semiconductor device | |
| DE2961314D1 (en) | Sealed can and preformed closure element therefor, as well as method and apparatuses for manufacturing them | |
| BR8101191A (pt) | Conjunto de sensor de radiacao semicondutor | |
| JPS548464A (en) | Insulation coating method to film carrier | |
| NO155280C (no) | Apparat til forsegling av ventilen i en ventilsekk med et klebestoff. | |
| JPS5632736A (en) | Sealing method of hybrid integrated circuit device | |
| JPS57173948A (en) | Manufacture of semiconductor device | |
| JPS57152157A (en) | Semiconductor device | |
| JPS57135922A (en) | Electro-optic cell | |
| JPS5724542A (en) | Preparation of resin sealed type semiconductor device | |
| JPS56147452A (en) | Semiconductor device | |
| JPS56161658A (en) | Semiconductor device | |
| JPS57107060A (en) | Semiconductor device | |
| JPS57201053A (en) | Sealing method for semiconductor device | |
| JPS55140249A (en) | Semiconductor device | |
| JPS5664456A (en) | Sealing method of semiconductor element | |
| JPS5722768A (en) | Applying vessel with capillary applying tool element | |
| JPS57106184A (en) | Manufacture of airtight window | |
| JPS55157274A (en) | Solar battery device | |
| JPS574146A (en) | Package of semiconductor device | |
| JPS51144180A (en) | Resin sealing method of semiconductor unit | |
| JPS5487181A (en) | Resin sealing method for semiconductor element | |
| JPS5764955A (en) | Semiconductor device | |
| JPS54121091A (en) | Crystal oscillator | |
| ATA471380A (de) | Vorrichtung zum konzentrieren von sonnenstrahlen |