JPS56100435A - Face-down bonder - Google Patents

Face-down bonder

Info

Publication number
JPS56100435A
JPS56100435A JP206680A JP206680A JPS56100435A JP S56100435 A JPS56100435 A JP S56100435A JP 206680 A JP206680 A JP 206680A JP 206680 A JP206680 A JP 206680A JP S56100435 A JPS56100435 A JP S56100435A
Authority
JP
Japan
Prior art keywords
pattern
chip
substrate
block
photopath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP206680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6239537B2 (cg-RX-API-DMAC10.html
Inventor
Osamu Tachibana
Tetsuo Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP206680A priority Critical patent/JPS56100435A/ja
Publication of JPS56100435A publication Critical patent/JPS56100435A/ja
Publication of JPS6239537B2 publication Critical patent/JPS6239537B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/072—
    • H10W72/0711—
    • H10W72/07178—
    • H10W72/07236—

Landscapes

  • Wire Bonding (AREA)
JP206680A 1980-01-14 1980-01-14 Face-down bonder Granted JPS56100435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP206680A JPS56100435A (en) 1980-01-14 1980-01-14 Face-down bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP206680A JPS56100435A (en) 1980-01-14 1980-01-14 Face-down bonder

Publications (2)

Publication Number Publication Date
JPS56100435A true JPS56100435A (en) 1981-08-12
JPS6239537B2 JPS6239537B2 (cg-RX-API-DMAC10.html) 1987-08-24

Family

ID=11518962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP206680A Granted JPS56100435A (en) 1980-01-14 1980-01-14 Face-down bonder

Country Status (1)

Country Link
JP (1) JPS56100435A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01119031A (ja) * 1987-10-31 1989-05-11 Nec Corp ペレットボンディング装置
WO2024014077A1 (ja) * 2022-07-11 2024-01-18 パナソニックＩｐマネジメント株式会社 位置決め装置、実装装置、位置決め方法および実装方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01119031A (ja) * 1987-10-31 1989-05-11 Nec Corp ペレットボンディング装置
WO2024014077A1 (ja) * 2022-07-11 2024-01-18 パナソニックＩｐマネジメント株式会社 位置決め装置、実装装置、位置決め方法および実装方法

Also Published As

Publication number Publication date
JPS6239537B2 (cg-RX-API-DMAC10.html) 1987-08-24

Similar Documents

Publication Publication Date Title
BG50833A3 (en) Process for coating glass
DE3686457D1 (de) Verfahren zum herstellen eines halbleiterapparates mit zwei halbleiteranordnungen.
BG50832A3 (en) Method and device for coating glass
EP0148448A3 (en) Etching method
JPS56100435A (en) Face-down bonder
ATE163800T1 (de) Verfahren und vorrichtung zum stapeln von substraten, die durch bonden miteinander zu verbinden sind
ATE150584T1 (de) Verfahren und vorrichtung zum herstellen von übergängen durch diffusion in substrate von solarzellen
JPS57173952A (en) Positioning method of semiconductor chip
JPS57147245A (en) Positioning method and device for chip bonding
DE3481743D1 (de) Diffusionsverfahren zum herstellen eines thyristors.
JPS5286546A (en) Microwave heating device
JPS5763844A (en) Dividing method for semiconductor wafer
JPS5640252A (en) Transfer positioning device for chip bonder
JPS5410670A (en) Bonding method of semiconductor chips
JPS53133366A (en) Impurity diffusion method
JPS5427364A (en) Metal wire bonding method for semiconductor device
JPS5297504A (en) Process for laying rail
JPS6410636A (en) Manufacture of hybrid integrated circuit
JPS5413264A (en) Bonding method of semiconductor chip
JPS52127072A (en) Wire bonding apparatus
JPS5419624A (en) Adhering method of adhesive tape
JPS5726434A (en) Wafer target pattern for alignment
JPS5379382A (en) Forming method of passivation film
JPS5216971A (en) Base plate heat treatment method and wafer for semiconductor
JPS5723234A (en) Pattern detecting method of full automatic wire bonding