JPS6239537B2 - - Google Patents
Info
- Publication number
- JPS6239537B2 JPS6239537B2 JP55002066A JP206680A JPS6239537B2 JP S6239537 B2 JPS6239537 B2 JP S6239537B2 JP 55002066 A JP55002066 A JP 55002066A JP 206680 A JP206680 A JP 206680A JP S6239537 B2 JPS6239537 B2 JP S6239537B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- support tool
- chip
- substrate
- half mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W72/072—
-
- H10W72/0711—
-
- H10W72/07178—
-
- H10W72/07236—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP206680A JPS56100435A (en) | 1980-01-14 | 1980-01-14 | Face-down bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP206680A JPS56100435A (en) | 1980-01-14 | 1980-01-14 | Face-down bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56100435A JPS56100435A (en) | 1981-08-12 |
| JPS6239537B2 true JPS6239537B2 (cg-RX-API-DMAC10.html) | 1987-08-24 |
Family
ID=11518962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP206680A Granted JPS56100435A (en) | 1980-01-14 | 1980-01-14 | Face-down bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56100435A (cg-RX-API-DMAC10.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0687467B2 (ja) * | 1987-10-31 | 1994-11-02 | 日本電気株式会社 | ペレットボンディング装置 |
| WO2024014077A1 (ja) * | 2022-07-11 | 2024-01-18 | パナソニックIpマネジメント株式会社 | 位置決め装置、実装装置、位置決め方法および実装方法 |
-
1980
- 1980-01-14 JP JP206680A patent/JPS56100435A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56100435A (en) | 1981-08-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5195234A (en) | Method and apparatus for visual alignment of parts | |
| KR102132094B1 (ko) | 전자 부품 실장 장치 및 전자 부품 실장 방법 | |
| US3684384A (en) | Positioning arrangement and face down bonder incorporating the same | |
| JP3747515B2 (ja) | チップマウント装置 | |
| JPS6239537B2 (cg-RX-API-DMAC10.html) | ||
| JP2820526B2 (ja) | フリップチップボンディングの位置合わせ方法及び装置 | |
| JP2828503B2 (ja) | フリップチップボンダー装置及び該装置の位置合わせ方法 | |
| TWI781859B (zh) | 基板接合裝置及基板接合方法 | |
| JPH0212024B2 (cg-RX-API-DMAC10.html) | ||
| TWI765549B (zh) | 電子零件的安裝裝置 | |
| JP2757037B2 (ja) | ボンディング装置 | |
| JP7757255B2 (ja) | 実装装置 | |
| JP3209250B2 (ja) | 光電子集積回路実装装置 | |
| KR100339494B1 (ko) | 반도체패키지 제조를 위한 웨이퍼와 써킷테이프의 접착 방법 | |
| JPS6339118B2 (cg-RX-API-DMAC10.html) | ||
| JPH0430538A (ja) | 半導体素子の位置合せ方法および位置合せ装置 | |
| JPH0380346B2 (cg-RX-API-DMAC10.html) | ||
| JPS6257098B2 (cg-RX-API-DMAC10.html) | ||
| JP2002176295A (ja) | 部品実装装置 | |
| JPH0139216B2 (cg-RX-API-DMAC10.html) | ||
| JP2651685B2 (ja) | ボンディング装置 | |
| JPS61119054A (ja) | 自動ワイヤボンデイング装置 | |
| JPH0430537A (ja) | 半導体素子の位置合せ方法および位置合せ装置 | |
| JPH0810188Y2 (ja) | ボンディング装置 | |
| WO2025118333A1 (zh) | 一种带有系统误差补偿功能的键合装置以及方法 |