JPS56100435A - Face-down bonder - Google Patents

Face-down bonder

Info

Publication number
JPS56100435A
JPS56100435A JP206680A JP206680A JPS56100435A JP S56100435 A JPS56100435 A JP S56100435A JP 206680 A JP206680 A JP 206680A JP 206680 A JP206680 A JP 206680A JP S56100435 A JPS56100435 A JP S56100435A
Authority
JP
Japan
Prior art keywords
pattern
chip
substrate
block
photopath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP206680A
Other languages
Japanese (ja)
Other versions
JPS6239537B2 (en
Inventor
Osamu Tachibana
Tetsuo Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP206680A priority Critical patent/JPS56100435A/en
Publication of JPS56100435A publication Critical patent/JPS56100435A/en
Publication of JPS6239537B2 publication Critical patent/JPS6239537B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To perform position matching by a method wherein the surface of a substrate on a block and the lower surface of a chip in a supporting tool are projected by an optical system, two photopaths are intercepted alternately, a pattern obtained from the optical system is binarized to determine a position, the amount of slippage from a reference pattern is calculated and the block or supporting tool is controlled and moved. CONSTITUTION:The substrate 3 and the chip 1 are fitted to the block 5 and the supporting tool 13 respectively, a shutter 21 is advance to intercept the photopath of a chip pattern, while a substrate pattern is projected on the screen of TV16, binatized 23, compared 24 with the reference pattern to calculate 25 the amount of slippage, and the block 5 is controlled and driven 26 to turn the slippage into zero. Next, a shutter 22 is advanced to intercept the photopath 18 of the substrate pattern, the photopath 17 is opened to project the chip pattern on the screen of TV16, whereby it is made to accord with the reference pattern. As the result, the chip pattern is correctly positioned on the substrate pattern. Then, the shutter 22 is moved back, a supporting body 14 is made to approach the block 5 and the bump electrode 2 of the chip 1 is laid on the wiring layer 4 of the substrate 3 to be heated for connection. By this constitution, the position matching can be performed automatically and thereby the efficiency of operation is improved.
JP206680A 1980-01-14 1980-01-14 Face-down bonder Granted JPS56100435A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP206680A JPS56100435A (en) 1980-01-14 1980-01-14 Face-down bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP206680A JPS56100435A (en) 1980-01-14 1980-01-14 Face-down bonder

Publications (2)

Publication Number Publication Date
JPS56100435A true JPS56100435A (en) 1981-08-12
JPS6239537B2 JPS6239537B2 (en) 1987-08-24

Family

ID=11518962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP206680A Granted JPS56100435A (en) 1980-01-14 1980-01-14 Face-down bonder

Country Status (1)

Country Link
JP (1) JPS56100435A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01119031A (en) * 1987-10-31 1989-05-11 Nec Corp Pellet bonding device
WO2024014077A1 (en) * 2022-07-11 2024-01-18 パナソニックＩｐマネジメント株式会社 Positioning device, mounting device, positioning method and mounting method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01119031A (en) * 1987-10-31 1989-05-11 Nec Corp Pellet bonding device
WO2024014077A1 (en) * 2022-07-11 2024-01-18 パナソニックＩｐマネジメント株式会社 Positioning device, mounting device, positioning method and mounting method

Also Published As

Publication number Publication date
JPS6239537B2 (en) 1987-08-24

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