JPS6417438A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS6417438A
JPS6417438A JP62173200A JP17320087A JPS6417438A JP S6417438 A JPS6417438 A JP S6417438A JP 62173200 A JP62173200 A JP 62173200A JP 17320087 A JP17320087 A JP 17320087A JP S6417438 A JPS6417438 A JP S6417438A
Authority
JP
Japan
Prior art keywords
capillary
lifting
electric torch
time
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62173200A
Other languages
Japanese (ja)
Other versions
JP2558717B2 (en
Inventor
Akihiro Yamamoto
Yutaka Makino
Shinji Kaino
Shinya Matsumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62173200A priority Critical patent/JP2558717B2/en
Publication of JPS6417438A publication Critical patent/JPS6417438A/en
Application granted granted Critical
Publication of JP2558717B2 publication Critical patent/JP2558717B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To remarkably reduce a time required for the lifting of a capillary and to shorten a bonding time, by using a lifting means to vary a height position of an electric torch and by setting a rise position of the capillary in accordance with the height position of the torch. CONSTITUTION:Wire bonding is applied to a semiconductor 31 located on a position where an electric torch 19 interferes with a large-scaled part 32 at the time of a bonding operation. Then a lifting drive cylinder 21 is made on a state of contraction, and the electric torch 19 is positioned as high as it does not interfere with the large-scaled part 32. Further, a revolution angle of an AC servo motor 18 is set so that a rise position of a capillary 7 is also made high by a distance Z1 from a substrate 2 in accordance with the position of the electric torch 19. Hence, a time required for lifting the capillary 7 is remarkably reduced to shorten a bonding time.
JP62173200A 1987-07-10 1987-07-10 Wire bonding equipment Expired - Lifetime JP2558717B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62173200A JP2558717B2 (en) 1987-07-10 1987-07-10 Wire bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62173200A JP2558717B2 (en) 1987-07-10 1987-07-10 Wire bonding equipment

Publications (2)

Publication Number Publication Date
JPS6417438A true JPS6417438A (en) 1989-01-20
JP2558717B2 JP2558717B2 (en) 1996-11-27

Family

ID=15955962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62173200A Expired - Lifetime JP2558717B2 (en) 1987-07-10 1987-07-10 Wire bonding equipment

Country Status (1)

Country Link
JP (1) JP2558717B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002081995A (en) * 2000-05-19 2002-03-22 De Dietrich & Co Apparatus for housing probe for measuring temperature of container

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002081995A (en) * 2000-05-19 2002-03-22 De Dietrich & Co Apparatus for housing probe for measuring temperature of container

Also Published As

Publication number Publication date
JP2558717B2 (en) 1996-11-27

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term