JPS5588352A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5588352A
JPS5588352A JP16380778A JP16380778A JPS5588352A JP S5588352 A JPS5588352 A JP S5588352A JP 16380778 A JP16380778 A JP 16380778A JP 16380778 A JP16380778 A JP 16380778A JP S5588352 A JPS5588352 A JP S5588352A
Authority
JP
Japan
Prior art keywords
film
exposed
capacitor
light
oxidized film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16380778A
Other languages
English (en)
Other versions
JPS5856268B2 (ja
Inventor
Hiroshi Shibata
Tatsuya Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP53163807A priority Critical patent/JPS5856268B2/ja
Priority to US06/107,285 priority patent/US4335505A/en
Publication of JPS5588352A publication Critical patent/JPS5588352A/ja
Publication of JPS5856268B2 publication Critical patent/JPS5856268B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/01—Manufacture or treatment
    • H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
    • H10B12/05—Making the transistor
JP53163807A 1978-12-26 1978-12-26 半導体装置の製造方法 Expired JPS5856268B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP53163807A JPS5856268B2 (ja) 1978-12-26 1978-12-26 半導体装置の製造方法
US06/107,285 US4335505A (en) 1978-12-26 1979-12-26 Method of manufacturing semiconductor memory device having memory cell elements composed of a transistor and a capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53163807A JPS5856268B2 (ja) 1978-12-26 1978-12-26 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5588352A true JPS5588352A (en) 1980-07-04
JPS5856268B2 JPS5856268B2 (ja) 1983-12-14

Family

ID=15781071

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53163807A Expired JPS5856268B2 (ja) 1978-12-26 1978-12-26 半導体装置の製造方法

Country Status (2)

Country Link
US (1) US4335505A (ja)
JP (1) JPS5856268B2 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4536941A (en) * 1980-03-21 1985-08-27 Kuo Chang Kiang Method of making high density dynamic memory cell
US4403394A (en) * 1980-12-17 1983-09-13 International Business Machines Corporation Formation of bit lines for ram device
US4534104A (en) * 1982-02-26 1985-08-13 Ncr Corporation Mixed dielectric process and nonvolatile memory device fabricated thereby
JPS6018948A (ja) * 1983-07-12 1985-01-31 Nec Corp 半導体集積回路装置
US4502894A (en) * 1983-08-12 1985-03-05 Fairchild Camera & Instrument Corporation Method of fabricating polycrystalline silicon resistors in integrated circuit structures using outdiffusion
JPS62198153A (ja) * 1986-02-26 1987-09-01 Nec Corp 半導体装置
US4826779A (en) * 1986-10-24 1989-05-02 Teledyne Industries, Inc. Integrated capacitor and method of fabricating same
JPH0817224B2 (ja) * 1988-08-03 1996-02-21 株式会社東芝 半導体記憶装置の製造方法
US5440174A (en) * 1992-10-20 1995-08-08 Matsushita Electric Industrial Co., Ltd. Plurality of passive elements in a semiconductor integrated circuit and semiconductor integrated circuit in which passive elements are arranged
JP3422580B2 (ja) * 1994-12-16 2003-06-30 三菱電機株式会社 半導体装置の製造方法
US5714411A (en) * 1995-01-03 1998-02-03 Motorola, Inc. Process for forming a semiconductor device including a capacitor
US5926359A (en) * 1996-04-01 1999-07-20 International Business Machines Corporation Metal-insulator-metal capacitor
US20010013660A1 (en) * 1999-01-04 2001-08-16 Peter Richard Duncombe Beol decoupling capacitor
JP2022524103A (ja) 2019-03-08 2022-04-27 メビオン・メディカル・システムズ・インコーポレーテッド カラム別の放射線の照射およびそのための治療計画の生成

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279679A (en) * 1975-12-26 1977-07-04 Toshiba Corp Semiconductor memory device
US4173819A (en) * 1976-02-13 1979-11-13 Tokyo Shibaura Electric Co., Ltd. Method of manufacturing a dynamic random access memory using MOS FETS
US4232439A (en) * 1976-11-30 1980-11-11 Vlsi Technology Research Association Masking technique usable in manufacturing semiconductor devices
US4240195A (en) * 1978-09-15 1980-12-23 Bell Telephone Laboratories, Incorporated Dynamic random access memory
US4240845A (en) * 1980-02-04 1980-12-23 International Business Machines Corporation Method of fabricating random access memory device

Also Published As

Publication number Publication date
US4335505A (en) 1982-06-22
JPS5856268B2 (ja) 1983-12-14

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