JPS5586134A - Cracking method of semiconductor substrate - Google Patents

Cracking method of semiconductor substrate

Info

Publication number
JPS5586134A
JPS5586134A JP16162278A JP16162278A JPS5586134A JP S5586134 A JPS5586134 A JP S5586134A JP 16162278 A JP16162278 A JP 16162278A JP 16162278 A JP16162278 A JP 16162278A JP S5586134 A JPS5586134 A JP S5586134A
Authority
JP
Japan
Prior art keywords
substrate
films
air
semiconductor substrate
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16162278A
Other languages
Japanese (ja)
Inventor
Akinori Tanizaki
Noboru Ando
Kunimichi Nakao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16162278A priority Critical patent/JPS5586134A/en
Publication of JPS5586134A publication Critical patent/JPS5586134A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To split a semiconductor substrate satisfactorily by a method wherein the substrate having a scribed groove is sandwiched in between plastic films and difference in air pressure is provided between both sides.
CONSTITUTION: A substrate 2 having a scribe groove 1 on the under surface is sandwiched in between 2 sheets of pressure sensitive adhesive plastic films 3, 3' removing air bubbles. After placing the films 3, 3' between a vessel 5 and a lid 7 simultaneously discharging air 4, 6, the air is gradually introduced 6 into the lid side 7, then the substrate is divided into chips 8 because the films are curved. This constitution prevents the chips from being broken and damaged because no pressure is added by a hard roller.
COPYRIGHT: (C)1980,JPO&Japio
JP16162278A 1978-12-23 1978-12-23 Cracking method of semiconductor substrate Pending JPS5586134A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16162278A JPS5586134A (en) 1978-12-23 1978-12-23 Cracking method of semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16162278A JPS5586134A (en) 1978-12-23 1978-12-23 Cracking method of semiconductor substrate

Publications (1)

Publication Number Publication Date
JPS5586134A true JPS5586134A (en) 1980-06-28

Family

ID=15738671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16162278A Pending JPS5586134A (en) 1978-12-23 1978-12-23 Cracking method of semiconductor substrate

Country Status (1)

Country Link
JP (1) JPS5586134A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012227371A (en) * 2011-04-20 2012-11-15 Disco Abrasive Syst Ltd Processing method of package substrate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012227371A (en) * 2011-04-20 2012-11-15 Disco Abrasive Syst Ltd Processing method of package substrate

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