JPS5513909A - Division method for semiconductor wafer - Google Patents

Division method for semiconductor wafer

Info

Publication number
JPS5513909A
JPS5513909A JP8614478A JP8614478A JPS5513909A JP S5513909 A JPS5513909 A JP S5513909A JP 8614478 A JP8614478 A JP 8614478A JP 8614478 A JP8614478 A JP 8614478A JP S5513909 A JPS5513909 A JP S5513909A
Authority
JP
Japan
Prior art keywords
wafer
plate
roller
tape
adhering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8614478A
Other languages
Japanese (ja)
Inventor
Tsutomu Nagatomi
Tsuneo Kida
Sadatake Kikuchi
Toshinobu Kita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP8614478A priority Critical patent/JPS5513909A/en
Publication of JPS5513909A publication Critical patent/JPS5513909A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)

Abstract

PURPOSE: To improve yield by adhering a wafer to a weakly adhesive tape, forming dividing grooves in the surface of the wafer, adhering the grooved surface to a flexible plate, placing a thin plate on the tape, and then applying a roller to the thin plate to divide the wafer.
CONSTITUTION: A silicon wafer 1 is sticked to a tape 2 having a low adhesive capacity to form a slot 3 on the surface of the wafer. The main surface having the slot 3 provided therein is mounted through a protective sheet 4 on a rubber plate 5. A roller 6 runs on a transparent vinyl chloride plate 10 having the thickness of 400 microns about, mounted on the upper surface of the water 1. According to such a construction, the sefects of a chip corner and the productivity of twin chips can be reduced and a degree of choice freedom for the roller diameter and division speed be improved as well.
COPYRIGHT: (C)1980,JPO&Japio
JP8614478A 1978-07-17 1978-07-17 Division method for semiconductor wafer Pending JPS5513909A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8614478A JPS5513909A (en) 1978-07-17 1978-07-17 Division method for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8614478A JPS5513909A (en) 1978-07-17 1978-07-17 Division method for semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5513909A true JPS5513909A (en) 1980-01-31

Family

ID=13878526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8614478A Pending JPS5513909A (en) 1978-07-17 1978-07-17 Division method for semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5513909A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0743146A1 (en) * 1995-05-19 1996-11-20 New American Supply Corporation S.A.R.L. Method and equipment for producing a covering material with decorative cuts

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0743146A1 (en) * 1995-05-19 1996-11-20 New American Supply Corporation S.A.R.L. Method and equipment for producing a covering material with decorative cuts
FR2734198A1 (en) * 1995-05-19 1996-11-22 New American Supply Corp Sarl METHOD AND INSTALLATION FOR MANUFACTURING DECORATIVE DECORATIVE COATING MATERIAL

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