JPS5513909A - Division method for semiconductor wafer - Google Patents
Division method for semiconductor waferInfo
- Publication number
- JPS5513909A JPS5513909A JP8614478A JP8614478A JPS5513909A JP S5513909 A JPS5513909 A JP S5513909A JP 8614478 A JP8614478 A JP 8614478A JP 8614478 A JP8614478 A JP 8614478A JP S5513909 A JPS5513909 A JP S5513909A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plate
- roller
- tape
- adhering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To improve yield by adhering a wafer to a weakly adhesive tape, forming dividing grooves in the surface of the wafer, adhering the grooved surface to a flexible plate, placing a thin plate on the tape, and then applying a roller to the thin plate to divide the wafer.
CONSTITUTION: A silicon wafer 1 is sticked to a tape 2 having a low adhesive capacity to form a slot 3 on the surface of the wafer. The main surface having the slot 3 provided therein is mounted through a protective sheet 4 on a rubber plate 5. A roller 6 runs on a transparent vinyl chloride plate 10 having the thickness of 400 microns about, mounted on the upper surface of the water 1. According to such a construction, the sefects of a chip corner and the productivity of twin chips can be reduced and a degree of choice freedom for the roller diameter and division speed be improved as well.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8614478A JPS5513909A (en) | 1978-07-17 | 1978-07-17 | Division method for semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8614478A JPS5513909A (en) | 1978-07-17 | 1978-07-17 | Division method for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5513909A true JPS5513909A (en) | 1980-01-31 |
Family
ID=13878526
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8614478A Pending JPS5513909A (en) | 1978-07-17 | 1978-07-17 | Division method for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5513909A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0743146A1 (en) * | 1995-05-19 | 1996-11-20 | New American Supply Corporation S.A.R.L. | Method and equipment for producing a covering material with decorative cuts |
-
1978
- 1978-07-17 JP JP8614478A patent/JPS5513909A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0743146A1 (en) * | 1995-05-19 | 1996-11-20 | New American Supply Corporation S.A.R.L. | Method and equipment for producing a covering material with decorative cuts |
FR2734198A1 (en) * | 1995-05-19 | 1996-11-22 | New American Supply Corp Sarl | METHOD AND INSTALLATION FOR MANUFACTURING DECORATIVE DECORATIVE COATING MATERIAL |
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