JPS5585046A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5585046A
JPS5585046A JP15747678A JP15747678A JPS5585046A JP S5585046 A JPS5585046 A JP S5585046A JP 15747678 A JP15747678 A JP 15747678A JP 15747678 A JP15747678 A JP 15747678A JP S5585046 A JPS5585046 A JP S5585046A
Authority
JP
Japan
Prior art keywords
resin
bodies
washers
flange portion
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15747678A
Other languages
Japanese (ja)
Inventor
Mitsuo Ito
Takashi Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15747678A priority Critical patent/JPS5585046A/en
Publication of JPS5585046A publication Critical patent/JPS5585046A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To eliminate the influence of cracks to a resin sealing body of a semiconductor element while decreasing number of mounted parts, by simultaneously forming the resin sealing body and resin bodies functioning as washers by using connecting bodies in the same resin bodies.
CONSTITUTION: A semiconductor element pellet 6 is installed onto a radiator plate 5 of a central portion of a metallic flange portion 3, and each electrode of the element pellet 6 is connected to three leads 7a, 7b, 7c by employing wires. A resin mold body 1 for sealing the semiconductor element pellet on the flange portion, washers 9 consisting of resin mold bodies made up into holes 8 with non-circular sections built up to the flange portion, and thin resin connecting bodies 10 for connecting the washers 9 and the resin mold body 1 are simultaneously formed. Since the washers are separated by means of the connecting bodies, the effect of cracks to the main body can be prevented.
COPYRIGHT: (C)1980,JPO&Japio
JP15747678A 1978-12-22 1978-12-22 Semiconductor device Pending JPS5585046A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15747678A JPS5585046A (en) 1978-12-22 1978-12-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15747678A JPS5585046A (en) 1978-12-22 1978-12-22 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5585046A true JPS5585046A (en) 1980-06-26

Family

ID=15650507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15747678A Pending JPS5585046A (en) 1978-12-22 1978-12-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5585046A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018939A (en) * 1983-07-13 1985-01-31 Hitachi Micro Comput Eng Ltd Resin seal type semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018939A (en) * 1983-07-13 1985-01-31 Hitachi Micro Comput Eng Ltd Resin seal type semiconductor device
JPH0522391B2 (en) * 1983-07-13 1993-03-29 Hitachi Seisakusho Kk

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