JPS5585046A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5585046A JPS5585046A JP15747678A JP15747678A JPS5585046A JP S5585046 A JPS5585046 A JP S5585046A JP 15747678 A JP15747678 A JP 15747678A JP 15747678 A JP15747678 A JP 15747678A JP S5585046 A JPS5585046 A JP S5585046A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- bodies
- washers
- flange portion
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To eliminate the influence of cracks to a resin sealing body of a semiconductor element while decreasing number of mounted parts, by simultaneously forming the resin sealing body and resin bodies functioning as washers by using connecting bodies in the same resin bodies.
CONSTITUTION: A semiconductor element pellet 6 is installed onto a radiator plate 5 of a central portion of a metallic flange portion 3, and each electrode of the element pellet 6 is connected to three leads 7a, 7b, 7c by employing wires. A resin mold body 1 for sealing the semiconductor element pellet on the flange portion, washers 9 consisting of resin mold bodies made up into holes 8 with non-circular sections built up to the flange portion, and thin resin connecting bodies 10 for connecting the washers 9 and the resin mold body 1 are simultaneously formed. Since the washers are separated by means of the connecting bodies, the effect of cracks to the main body can be prevented.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15747678A JPS5585046A (en) | 1978-12-22 | 1978-12-22 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15747678A JPS5585046A (en) | 1978-12-22 | 1978-12-22 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5585046A true JPS5585046A (en) | 1980-06-26 |
Family
ID=15650507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15747678A Pending JPS5585046A (en) | 1978-12-22 | 1978-12-22 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5585046A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6018939A (en) * | 1983-07-13 | 1985-01-31 | Hitachi Micro Comput Eng Ltd | Resin seal type semiconductor device |
-
1978
- 1978-12-22 JP JP15747678A patent/JPS5585046A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6018939A (en) * | 1983-07-13 | 1985-01-31 | Hitachi Micro Comput Eng Ltd | Resin seal type semiconductor device |
JPH0522391B2 (en) * | 1983-07-13 | 1993-03-29 | Hitachi Seisakusho Kk |
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