JPS5572074A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS5572074A JPS5572074A JP14746278A JP14746278A JPS5572074A JP S5572074 A JPS5572074 A JP S5572074A JP 14746278 A JP14746278 A JP 14746278A JP 14746278 A JP14746278 A JP 14746278A JP S5572074 A JPS5572074 A JP S5572074A
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- capacitor
- transistor
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
Landscapes
- Semiconductor Memories (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
PURPOSE:To simplify the element production process by making up a pattern of a pair of memory elements comprising a transistor and a capacitor of a resist having a shielding property against parallel beam such as light and X rays and leaving a part of the film utilizing shade developed by sharp projection of the beam. CONSTITUTION:A thick SiO2 is formed at either end of an Si substrate. A thin SiO2 film 3 is allowed to grow on the capacitor-formed region of the substrate surrounded by the film and a polycrystaline Si film 10 is done so on the film 3 covering the film 2. Then, a pattern of a thick resist film 11 is provided and the substrate 1 is exposed by etching in the given area which is entirely coated with an Si3N4 film 12. Parallel ion beam is irradiated slantly to the film 12 so that the area thereof behind the film 11 is left. Subsequently, the film 11 is removed to form a given diffused region 5 and a layer insulation oxidized film 6 is provided. Thus, a transistor is formed by a generally accepted method. This method elminates the need for making contact holes on the memory cell.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14746278A JPS5572074A (en) | 1978-11-25 | 1978-11-25 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14746278A JPS5572074A (en) | 1978-11-25 | 1978-11-25 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5572074A true JPS5572074A (en) | 1980-05-30 |
Family
ID=15430909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14746278A Pending JPS5572074A (en) | 1978-11-25 | 1978-11-25 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5572074A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57117272A (en) * | 1980-11-28 | 1982-07-21 | Philips Nv | Semiconductor device |
-
1978
- 1978-11-25 JP JP14746278A patent/JPS5572074A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57117272A (en) * | 1980-11-28 | 1982-07-21 | Philips Nv | Semiconductor device |
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