JPS5568653A - Manufacturing method of semiconductor device - Google Patents
Manufacturing method of semiconductor deviceInfo
- Publication number
- JPS5568653A JPS5568653A JP14309278A JP14309278A JPS5568653A JP S5568653 A JPS5568653 A JP S5568653A JP 14309278 A JP14309278 A JP 14309278A JP 14309278 A JP14309278 A JP 14309278A JP S5568653 A JPS5568653 A JP S5568653A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electrode
- film
- aluminum
- polycrystalline silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14309278A JPS5568653A (en) | 1978-11-20 | 1978-11-20 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14309278A JPS5568653A (en) | 1978-11-20 | 1978-11-20 | Manufacturing method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5568653A true JPS5568653A (en) | 1980-05-23 |
JPS6125217B2 JPS6125217B2 (ja) | 1986-06-14 |
Family
ID=15330718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14309278A Granted JPS5568653A (en) | 1978-11-20 | 1978-11-20 | Manufacturing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5568653A (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0242486Y2 (ja) * | 1984-10-19 | 1990-11-13 | ||
JPS6378817A (ja) * | 1986-09-20 | 1988-04-08 | Ota Sheet:Kk | 幌支持用フレ−ム |
JPH02103862U (ja) * | 1989-02-03 | 1990-08-17 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5119478A (en) * | 1974-08-09 | 1976-02-16 | Fujitsu Ltd | Handotaisochino seizohoho |
JPS5326692A (en) * | 1976-08-23 | 1978-03-11 | Ibm | Method of forming aluminum silicon conductor structure without projection |
-
1978
- 1978-11-20 JP JP14309278A patent/JPS5568653A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5119478A (en) * | 1974-08-09 | 1976-02-16 | Fujitsu Ltd | Handotaisochino seizohoho |
JPS5326692A (en) * | 1976-08-23 | 1978-03-11 | Ibm | Method of forming aluminum silicon conductor structure without projection |
Also Published As
Publication number | Publication date |
---|---|
JPS6125217B2 (ja) | 1986-06-14 |
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