JPS5559739A - Diving method of semiconductor wafer - Google Patents

Diving method of semiconductor wafer

Info

Publication number
JPS5559739A
JPS5559739A JP13164778A JP13164778A JPS5559739A JP S5559739 A JPS5559739 A JP S5559739A JP 13164778 A JP13164778 A JP 13164778A JP 13164778 A JP13164778 A JP 13164778A JP S5559739 A JPS5559739 A JP S5559739A
Authority
JP
Japan
Prior art keywords
pellets
wafer
liquid
masking sheet
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13164778A
Other languages
Japanese (ja)
Inventor
Kenpo Sumizawa
Tasuku Unno
Masami Kiyono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13164778A priority Critical patent/JPS5559739A/en
Publication of JPS5559739A publication Critical patent/JPS5559739A/en
Pending legal-status Critical Current

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  • Dicing (AREA)

Abstract

PURPOSE: To prevent the formation of flows on pellets, by transcribing and fixing a semiconductor wafer diced on a masking sheet to a liquid, which is a solid at low temperatures and is evaporated at high temperatres, and by moving the wafer to a support body, in a pelletizing process of the wafer.
CONSTITUTION: One side main surface of a semiconductor wafer that impurity diffusion treatment is completed is attached on a masking sheet 22, and the wafer is divided into a large number of semiconductor pellets 212 by means of dicing. The pellets are soaked in a vessel 24, to which a liquid 23 that is a solid at low temperatures and is vaporized at high temperatures is filled, while leaving the masking sheet 22, the liquid is solidified and the masking sheet 22 is exfoliated. The semiconductor pellets 212 are placed on a support base 25 while downward directing surfaces glued to the masking sheet 22 under a condition that the pellets are maintained in the vessel 24 in this way, and the liquid 23 is evaporated. Thus, the wafer can be pelletized in a shape that the pellets are arranged at regular intervals. As the liquid, for example, water can be used.
COPYRIGHT: (C)1980,JPO&Japio
JP13164778A 1978-10-27 1978-10-27 Diving method of semiconductor wafer Pending JPS5559739A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13164778A JPS5559739A (en) 1978-10-27 1978-10-27 Diving method of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13164778A JPS5559739A (en) 1978-10-27 1978-10-27 Diving method of semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS5559739A true JPS5559739A (en) 1980-05-06

Family

ID=15062938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13164778A Pending JPS5559739A (en) 1978-10-27 1978-10-27 Diving method of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5559739A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992009098A2 (en) * 1990-11-05 1992-05-29 Harris Corporation Process for forming extremely thin integrated circuit dice
JPH0495375U (en) * 1991-01-14 1992-08-18

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992009098A2 (en) * 1990-11-05 1992-05-29 Harris Corporation Process for forming extremely thin integrated circuit dice
WO1992009098A3 (en) * 1990-11-05 1992-07-09 Harris Corp Process for forming extremely thin integrated circuit dice
JPH0495375U (en) * 1991-01-14 1992-08-18

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