JPS5559739A - Diving method of semiconductor wafer - Google Patents
Diving method of semiconductor waferInfo
- Publication number
- JPS5559739A JPS5559739A JP13164778A JP13164778A JPS5559739A JP S5559739 A JPS5559739 A JP S5559739A JP 13164778 A JP13164778 A JP 13164778A JP 13164778 A JP13164778 A JP 13164778A JP S5559739 A JPS5559739 A JP S5559739A
- Authority
- JP
- Japan
- Prior art keywords
- pellets
- wafer
- liquid
- masking sheet
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To prevent the formation of flows on pellets, by transcribing and fixing a semiconductor wafer diced on a masking sheet to a liquid, which is a solid at low temperatures and is evaporated at high temperatres, and by moving the wafer to a support body, in a pelletizing process of the wafer.
CONSTITUTION: One side main surface of a semiconductor wafer that impurity diffusion treatment is completed is attached on a masking sheet 22, and the wafer is divided into a large number of semiconductor pellets 212 by means of dicing. The pellets are soaked in a vessel 24, to which a liquid 23 that is a solid at low temperatures and is vaporized at high temperatures is filled, while leaving the masking sheet 22, the liquid is solidified and the masking sheet 22 is exfoliated. The semiconductor pellets 212 are placed on a support base 25 while downward directing surfaces glued to the masking sheet 22 under a condition that the pellets are maintained in the vessel 24 in this way, and the liquid 23 is evaporated. Thus, the wafer can be pelletized in a shape that the pellets are arranged at regular intervals. As the liquid, for example, water can be used.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13164778A JPS5559739A (en) | 1978-10-27 | 1978-10-27 | Diving method of semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13164778A JPS5559739A (en) | 1978-10-27 | 1978-10-27 | Diving method of semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5559739A true JPS5559739A (en) | 1980-05-06 |
Family
ID=15062938
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13164778A Pending JPS5559739A (en) | 1978-10-27 | 1978-10-27 | Diving method of semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5559739A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992009098A2 (en) * | 1990-11-05 | 1992-05-29 | Harris Corporation | Process for forming extremely thin integrated circuit dice |
JPH0495375U (en) * | 1991-01-14 | 1992-08-18 |
-
1978
- 1978-10-27 JP JP13164778A patent/JPS5559739A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1992009098A2 (en) * | 1990-11-05 | 1992-05-29 | Harris Corporation | Process for forming extremely thin integrated circuit dice |
WO1992009098A3 (en) * | 1990-11-05 | 1992-07-09 | Harris Corp | Process for forming extremely thin integrated circuit dice |
JPH0495375U (en) * | 1991-01-14 | 1992-08-18 |
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