JPS5354384A - Method for slicing semi-conductor ingots - Google Patents

Method for slicing semi-conductor ingots

Info

Publication number
JPS5354384A
JPS5354384A JP12920776A JP12920776A JPS5354384A JP S5354384 A JPS5354384 A JP S5354384A JP 12920776 A JP12920776 A JP 12920776A JP 12920776 A JP12920776 A JP 12920776A JP S5354384 A JPS5354384 A JP S5354384A
Authority
JP
Japan
Prior art keywords
slicing
semi
conductor
ingots
prevent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12920776A
Other languages
Japanese (ja)
Inventor
Sokichi Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12920776A priority Critical patent/JPS5354384A/en
Publication of JPS5354384A publication Critical patent/JPS5354384A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/10—Arrangements for cooling or lubricating tools or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/02—Devices for lubricating or cooling circular saw blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To provide a method for slicing semi-conductor ingots, which comprises mixing a chemical decreasing the surface tension in a cooling solution in the case of slicing a semi-conductor ingot such as silicon or the like having a great diameter by means of a diamond wheel or the like, thereby to prevent the overheat due to friction heat to obtain a good wafer and prevent the defromation of the diamond wheel.
JP12920776A 1976-10-26 1976-10-26 Method for slicing semi-conductor ingots Pending JPS5354384A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12920776A JPS5354384A (en) 1976-10-26 1976-10-26 Method for slicing semi-conductor ingots

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12920776A JPS5354384A (en) 1976-10-26 1976-10-26 Method for slicing semi-conductor ingots

Publications (1)

Publication Number Publication Date
JPS5354384A true JPS5354384A (en) 1978-05-17

Family

ID=15003773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12920776A Pending JPS5354384A (en) 1976-10-26 1976-10-26 Method for slicing semi-conductor ingots

Country Status (1)

Country Link
JP (1) JPS5354384A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63144959A (en) * 1986-11-28 1988-06-17 ワッカー・ケミトロニク・ゲゼルシャフト・フュア・エレクトロニク・グルントシュトッフェ・ミット・ベシュレンクテル・ハフツング Method of thinning crystal rod or crystal block by using circular saw with inner hole and sawing it to disk and circular saw with said inner hole

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63144959A (en) * 1986-11-28 1988-06-17 ワッカー・ケミトロニク・ゲゼルシャフト・フュア・エレクトロニク・グルントシュトッフェ・ミット・ベシュレンクテル・ハフツング Method of thinning crystal rod or crystal block by using circular saw with inner hole and sawing it to disk and circular saw with said inner hole

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