JPS5558556A - Electronic component container - Google Patents

Electronic component container

Info

Publication number
JPS5558556A
JPS5558556A JP13130678A JP13130678A JPS5558556A JP S5558556 A JPS5558556 A JP S5558556A JP 13130678 A JP13130678 A JP 13130678A JP 13130678 A JP13130678 A JP 13130678A JP S5558556 A JPS5558556 A JP S5558556A
Authority
JP
Japan
Prior art keywords
projections
chip carriers
gaps
assembling
side walls
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13130678A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6135697B2 (enrdf_load_stackoverflow
Inventor
Kunihiko Hayashi
Takehisa Tsujimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13130678A priority Critical patent/JPS5558556A/ja
Publication of JPS5558556A publication Critical patent/JPS5558556A/ja
Publication of JPS6135697B2 publication Critical patent/JPS6135697B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP13130678A 1978-10-25 1978-10-25 Electronic component container Granted JPS5558556A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13130678A JPS5558556A (en) 1978-10-25 1978-10-25 Electronic component container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13130678A JPS5558556A (en) 1978-10-25 1978-10-25 Electronic component container

Publications (2)

Publication Number Publication Date
JPS5558556A true JPS5558556A (en) 1980-05-01
JPS6135697B2 JPS6135697B2 (enrdf_load_stackoverflow) 1986-08-14

Family

ID=15054867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13130678A Granted JPS5558556A (en) 1978-10-25 1978-10-25 Electronic component container

Country Status (1)

Country Link
JP (1) JPS5558556A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58170841U (ja) * 1982-05-10 1983-11-15 株式会社日立製作所 はんだ封止セラミツクパツケ−ジ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58170841U (ja) * 1982-05-10 1983-11-15 株式会社日立製作所 はんだ封止セラミツクパツケ−ジ

Also Published As

Publication number Publication date
JPS6135697B2 (enrdf_load_stackoverflow) 1986-08-14

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