JPS5555550A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5555550A JPS5555550A JP12798078A JP12798078A JPS5555550A JP S5555550 A JPS5555550 A JP S5555550A JP 12798078 A JP12798078 A JP 12798078A JP 12798078 A JP12798078 A JP 12798078A JP S5555550 A JPS5555550 A JP S5555550A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- piece
- carrying portion
- semiconductor device
- sealing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 7
- 238000007789 sealing Methods 0.000 abstract 3
- 238000005219 brazing Methods 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- WABPQHHGFIMREM-OUBTZVSYSA-N lead-208 Chemical compound [208Pb] WABPQHHGFIMREM-OUBTZVSYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12798078A JPS5555550A (en) | 1978-10-18 | 1978-10-18 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12798078A JPS5555550A (en) | 1978-10-18 | 1978-10-18 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5555550A true JPS5555550A (en) | 1980-04-23 |
| JPS6130741B2 JPS6130741B2 (enrdf_load_stackoverflow) | 1986-07-15 |
Family
ID=14973449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12798078A Granted JPS5555550A (en) | 1978-10-18 | 1978-10-18 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5555550A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60262649A (ja) * | 1984-06-11 | 1985-12-26 | Canon Inc | 液体噴射ヘッド |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4836595A (enrdf_load_stackoverflow) * | 1971-09-13 | 1973-05-30 | ||
| JPS501326U (enrdf_load_stackoverflow) * | 1973-04-26 | 1975-01-08 | ||
| JPS5345973A (en) * | 1976-10-06 | 1978-04-25 | Sharp Corp | Resin-sealing-type semiconductor device |
| JPS5360762U (enrdf_load_stackoverflow) * | 1976-10-25 | 1978-05-23 |
-
1978
- 1978-10-18 JP JP12798078A patent/JPS5555550A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4836595A (enrdf_load_stackoverflow) * | 1971-09-13 | 1973-05-30 | ||
| JPS501326U (enrdf_load_stackoverflow) * | 1973-04-26 | 1975-01-08 | ||
| JPS5345973A (en) * | 1976-10-06 | 1978-04-25 | Sharp Corp | Resin-sealing-type semiconductor device |
| JPS5360762U (enrdf_load_stackoverflow) * | 1976-10-25 | 1978-05-23 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60262649A (ja) * | 1984-06-11 | 1985-12-26 | Canon Inc | 液体噴射ヘッド |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6130741B2 (enrdf_load_stackoverflow) | 1986-07-15 |
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