JPS554985A - Lead frame for semiconductor device - Google Patents
Lead frame for semiconductor deviceInfo
- Publication number
- JPS554985A JPS554985A JP7839178A JP7839178A JPS554985A JP S554985 A JPS554985 A JP S554985A JP 7839178 A JP7839178 A JP 7839178A JP 7839178 A JP7839178 A JP 7839178A JP S554985 A JPS554985 A JP S554985A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- fixing
- burr
- frame
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7839178A JPS554985A (en) | 1978-06-27 | 1978-06-27 | Lead frame for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7839178A JPS554985A (en) | 1978-06-27 | 1978-06-27 | Lead frame for semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS554985A true JPS554985A (en) | 1980-01-14 |
JPS6333298B2 JPS6333298B2 (ja) | 1988-07-05 |
Family
ID=13660706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7839178A Granted JPS554985A (en) | 1978-06-27 | 1978-06-27 | Lead frame for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS554985A (ja) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5980949A (ja) * | 1983-07-01 | 1984-05-10 | Hitachi Ltd | 樹脂封止半導体装置 |
JPS5994449A (ja) * | 1983-07-01 | 1984-05-31 | Hitachi Ltd | 半導体装置 |
JPS60200553A (ja) * | 1984-03-26 | 1985-10-11 | Nec Corp | 半導体装置の製造方法 |
JPS61141164A (ja) * | 1984-12-13 | 1986-06-28 | Tamagawa Kikai Kinzoku Kk | 半導体装置用フレ−ムの製造方法およびその装置 |
JPS61104560U (ja) * | 1984-12-13 | 1986-07-03 | ||
JPS62204344U (ja) * | 1986-06-17 | 1987-12-26 | ||
JP2008016715A (ja) * | 2006-07-07 | 2008-01-24 | Sanyo Electric Co Ltd | フレームパッケージ型半導体レーザ装置 |
JP2008016714A (ja) * | 2006-07-07 | 2008-01-24 | Sanyo Electric Co Ltd | フレームパッケージ型半導体レーザ装置 |
JP2008021754A (ja) * | 2006-07-12 | 2008-01-31 | Sanyo Electric Co Ltd | フレームパッケージ型半導体レーザ装置 |
JP2010080913A (ja) * | 2008-08-28 | 2010-04-08 | Sanyo Electric Co Ltd | 樹脂封止型半導体装置及びその製造方法、樹脂封止型電子装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4942281A (ja) * | 1972-03-03 | 1974-04-20 | ||
JPS5180059U (ja) * | 1974-12-19 | 1976-06-25 |
-
1978
- 1978-06-27 JP JP7839178A patent/JPS554985A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4942281A (ja) * | 1972-03-03 | 1974-04-20 | ||
JPS5180059U (ja) * | 1974-12-19 | 1976-06-25 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5980949A (ja) * | 1983-07-01 | 1984-05-10 | Hitachi Ltd | 樹脂封止半導体装置 |
JPS5994449A (ja) * | 1983-07-01 | 1984-05-31 | Hitachi Ltd | 半導体装置 |
JPS60200553A (ja) * | 1984-03-26 | 1985-10-11 | Nec Corp | 半導体装置の製造方法 |
JPS61141164A (ja) * | 1984-12-13 | 1986-06-28 | Tamagawa Kikai Kinzoku Kk | 半導体装置用フレ−ムの製造方法およびその装置 |
JPS61104560U (ja) * | 1984-12-13 | 1986-07-03 | ||
JPH0143460B2 (ja) * | 1984-12-13 | 1989-09-20 | Mitsubishi Shindo Kk | |
JPS62204344U (ja) * | 1986-06-17 | 1987-12-26 | ||
JP2008016715A (ja) * | 2006-07-07 | 2008-01-24 | Sanyo Electric Co Ltd | フレームパッケージ型半導体レーザ装置 |
JP2008016714A (ja) * | 2006-07-07 | 2008-01-24 | Sanyo Electric Co Ltd | フレームパッケージ型半導体レーザ装置 |
JP2008021754A (ja) * | 2006-07-12 | 2008-01-31 | Sanyo Electric Co Ltd | フレームパッケージ型半導体レーザ装置 |
JP2010080913A (ja) * | 2008-08-28 | 2010-04-08 | Sanyo Electric Co Ltd | 樹脂封止型半導体装置及びその製造方法、樹脂封止型電子装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6333298B2 (ja) | 1988-07-05 |
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